填充型电火花精密堆焊接头的界面结合行为

lnterfacial behavior of filled joints by electrospark overlaying

摘要: 采用丝极焊材、小功率脉冲电火花热源、在槽内进行了填充型超低线能量电火花精密堆焊,并用光镜法和电子探针法对堆焊接头中焊缝与基体的界面结合行为进行了研究。结果表明,填充型电火花精密堆焊接头焊缝与基体的界面结合类型有:非均匀混合互熔结晶型、超薄层熔化互扩散结晶型和弱扩散无明显重结晶型。以上类型的界面结合均属于冶金结合。
- 电火花 /
- 堆焊 /
- 界面结合
Abstract: The interfacial behavior of filled joints by eleetrospark o-verlaying with filler wire,low pulse power and low energy input is researched,it is proved by microscopy,EPMA analysis that the interfaeia join overlayed by eleetrospark is metallurgy connection.At least the non-uniformly mixed mutual melting crystallization,the thin layer melting in-terdiffusion crystallization and the micrediffusion unconspieuous secondary solidification crystallization are concluded.
- electrospark /
- overlaying /
- interfacial join