Abstract: The interfacial behavior of filled joints by eleetrospark o-verlaying with filler wire,low pulse power and low energy input is researched,it is proved by microscopy,EPMA analysis that the interfaeia join overlayed by eleetrospark is metallurgy connection.At least the non-uniformly mixed mutual melting crystallization,the thin layer melting in-terdiffusion crystallization and the micrediffusion unconspieuous secondary solidification crystallization are concluded.