Si<sub>3</sub>N<sub>4</sub>陶瓷/Inconel 600合金液相诱导扩散连接接头的强度与断裂行为

Si₃N₄陶瓷/Inconel 600合金液相诱导扩散连接接头的强度与断裂行为

摘要: 利用Nb/Cu/Ni复合层作中间层,采用液相诱导扩散连接方法连接了Si₃N₄陶瓷/Inconel 600合金,用剪切试验评价接头强度,采用扫描电镜(SEM)观察接头的断口形貌,系统地分析了连接压力、连接时间,连接温度对Si₃N₄陶瓷/Inconel 600合金液相诱导扩散连接接头的强度和断裂行为的影响。结果表明,连接温度(在连接时间为3000 s以及连接压力为5 MPa条件下)、连接压力(在连接温度为1130℃以及连接时间为3000 s条件下)和连接时间(在连接温度为1130℃以及连接压力为10 MPa条件下)都与接头的剪切强度呈抛物线关系。

Abstract: Bonding of Si₃N₄ ceramic to Inconel 600 alloy was carried out by liquid phase inductive diffusion bonding (LPIDB) method with Nb/Cu/Ni multi-interlayer.Effect of bonding condition on joint strength and fracture behavior was investigated in the paper.Joint strength was evalua-ted by shear test,shear fracture surface of the joint was observed by SEM.It was shown that the parabolic relationship among the shear strength of the joint and bonding temperature (when bonding time is 3000 s and bonding pressure is 5 MPa),bonding pressure (when bonding temperature is 1 130℃ and bonding pressure is 10 MPa) was observed.