Abstract: A new soldering method-fluxless pressure soldering for SiC_w/6061Al composites was presented,and welding experiments for the effects of two parameters: the soldering temperature and pressure related to soldered joint strength and microstructure were carried out by using the Zn-Al filler metal.The contribution of assistant process-scrape was also discussed.The experimental results show that temperature and pressure are two key soldering process parameters,when the soldering temperature is in the range of 400~450℃ and the pressure is 30 MPa,the tensile strength of soldered joint reaches 252.0~263.3 MPa,which is up to 85%~90% of that of base metal.A number of microdimples,SiC_w whiskers,considerable quasicleavage together with residual pits of SiC whiskers are observed on the fracture,which identifies the reinforcement of SiC whiskers to the soldering seam.Moreover,the results of X-ray diffraction analysis indicate that the soldering seam mainly consists of a-Al(Zn) solid solution and uniform SiC whiskers.