玻璃与可阀合金的电场辅助阳极连接
Electric Field-assisted Anodic Bonding of Glass to Kovar Alloy
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摘要: 在施加电压为500 V、连接温度为613K的条件下,进行了玻璃与可阀合金的电场辅助阳极连接,用扫描电镜和电子探针对连接界面进行了观察和分析,测定了接头的剪切强度。结果表明,玻璃与可阀之间的紧密接触面积随连接时间的延长从初始接触区域开始逐步扩大。玻璃中的Na、K离子在电场作用下不断从阳极向阴极迁移,在靠近阳极表面处形成它们的耗尽层,耗尽层宽度亦随连接时间延长而增大。只要玻璃与可阀之间达到近100%的紧密接触和连接,连接接头即可达到稳定的强度,平均为8~12 MPa。对上述试验结果从理论上进行了分析和讨论。Abstract: Electric field-assisted anodic bonding of glass to Kovar alloy was preformed at temperature 613 K under applied voltage 500 V.The interfaces were investigated by SEM observation and EPMA analyses.In order to determine the joint strength,shear tests were carried out.The results show that intimately contacted area between Kovar alloy and the glass enlarges from initial contact area with increase of bonding time.Na and K ions involved in the glass move toward the cathode from the anode surface under the electric field,resulting in depleted layers of the adjacent anode surface.The thickness of depleted layers increases with increasing bonding time.The stable joint strength of about 8~12 MPa can be achieved as long as ≈100% intimately contacted area between Kovar alloy and the glass is obtained.These results are discussed by considering the inference of the applied electric field.