Abstract: Diffusion bonding of Si₃N₄ to Ni was carried out using non-active metal interlayers of FeNi/Cu under high and low vacuum conditions.After bonding,HIP processes were also used for some joints.Joint strength was determined by four-point bending tests.The joint interfaes were analyzed by mines of SEM,EPMA and XRD.The results shown that high joint strength could be obtained even under low vacuum bonding condition.The reaction layer of Ni-Si system compound was not formed at the interface between ceramic and the metal.Bonding time did not have visible effect on the joint strength.These characters are quite different from those when active metal is employed as interlayer in diffusion bonding.The method suggested in this paper has important foreground for engineering applications.