SiC/TiAl扩散连接接头的界面结构及连接强度

基金项目: 哈工大校管基金、国防科技预研基金和焊接国家重点实验室基金

Interface Structures and Bonding Strength of SiC/TiAl Joints in Diffusion Bonding

National Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology

摘要: 对常压烧结的SiC陶瓷与TiAl金属间化合物进行了真空扩散连接。采用扫描电镜、电子探针和X射线衍射分析等手段确定了反应产物的种类和接头的界面结构,并用拉剪试验评价了接头的连接强度。研究结果表明,SiC与TiAl扩散连接中生成了TiAl₂、TiC和Ti₅Si₃Cx三种新相,接头的界面结构为SiC/TiC/(TiC+Ti₅Si₃Cx)/(TiAl₂+TiAl)/TiAl。在1573K和1.8ks的连接条件下,接头室温剪切强度达到240MPa,高温(973K)剪切强度达到230MPa。
- SiC /
- TiAl /
- 扩散连接 /
- 界面结构 /
- 接头强度
Abstract: Diffusion bonding of Pressureless-sintered SiC ceramic to TiAl intermetallic compound was carried out. The kinds of the reaction products and the interface structures of the joints were investigated by SEM, EPMA and XRD. The bonding strength of the joints was evaluated by tension-shear test. The experimental results showed that the three kinds of new phases,TiAl₂, TiC and Ti₅Si₃C_X, occur during the diffusion bonding of SiC to TiAl and that the interface structures of the joints can be expressed by SiC/TiC/(TiC+Ti₅Si₃C_X)/(TiAl₂+TiAl)/TiAl. The shear strength of the joint, which was bonded at 1573 K for 1.8 ks, is up to 240 MPa at room temperature and 230 MPa at the test temperature of 973 K.
- SiC /
- TiAl /
- diffusion bonding /
- interface structure /
- bonding strength

1.	陈长新，李天庆，苏鑫，王昊. 氮气比例对金属粉末再压缩等离子弧焊接电弧电压和焊缝成形的影响. 精密成形工程. 2024(10): 217-224 . 百度学术
2.	李天庆，张宇，王凯，韩振扬，雷玉成. 金属粉末再压缩等离子弧焊接工艺. 焊接学报. 2021(12): 62-66+90+100 . 本站查看
3.	李天庆，杨喜牟，雷玉成，陈璐. 气流再压缩等离子弧焊接工艺初步探究. 焊接学报. 2019(11): 28-32+162 . 本站查看