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刘会杰, 冯吉才, 钱乙余. SiC/TiAl扩散连接接头的界面结构及连接强度[J]. 焊接学报, 1999, (3): 170-174.
引用本文: 刘会杰, 冯吉才, 钱乙余. SiC/TiAl扩散连接接头的界面结构及连接强度[J]. 焊接学报, 1999, (3): 170-174.
Liu Huijie, Feng Jicai, Qian Yiyu. Interface Structures and Bonding Strength of SiC/TiAl Joints in Diffusion Bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1999, (3): 170-174.
Citation: Liu Huijie, Feng Jicai, Qian Yiyu. Interface Structures and Bonding Strength of SiC/TiAl Joints in Diffusion Bonding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1999, (3): 170-174.

SiC/TiAl扩散连接接头的界面结构及连接强度

Interface Structures and Bonding Strength of SiC/TiAl Joints in Diffusion Bonding

  • 摘要: 对常压烧结的SiC陶瓷与TiAl金属间化合物进行了真空扩散连接。采用扫描电镜、电子探针和X射线衍射分析等手段确定了反应产物的种类和接头的界面结构,并用拉剪试验评价了接头的连接强度。研究结果表明,SiC与TiAl扩散连接中生成了TiAl2、TiC和Ti5Si3Cx三种新相,接头的界面结构为SiC/TiC/(TiC+Ti5Si3Cx)/(TiAl2+TiAl)/TiAl。在1573K和1.8ks的连接条件下,接头室温剪切强度达到240MPa,高温(973K)剪切强度达到230MPa。

     

    Abstract: Diffusion bonding of Pressureless-sintered SiC ceramic to TiAl intermetallic compound was carried out. The kinds of the reaction products and the interface structures of the joints were investigated by SEM, EPMA and XRD. The bonding strength of the joints was evaluated by tension-shear test. The experimental results showed that the three kinds of new phases,TiAl2, TiC and Ti5Si3CX, occur during the diffusion bonding of SiC to TiAl and that the interface structures of the joints can be expressed by SiC/TiC/(TiC+Ti5Si3CX)/(TiAl2+TiAl)/TiAl. The shear strength of the joint, which was bonded at 1573 K for 1.8 ks, is up to 240 MPa at room temperature and 230 MPa at the test temperature of 973 K.

     

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