用Fe-Ti合金扩散连接SiC陶瓷

Diffusion Bonding of SiC Ceramic by Fe-Ti Alloy

摘要: 利用Fe-Ti合金在1473~1723 K、0.9~5.4 ks的接合条件下对常压烧结SiC陶瓷进行了真空扩散连接,接头中形成TiC、FeSi、Ti₅Si₃反应相。试验结果表明,用Fe-50Ti(at%)合金,在1623 K、2.7 ks的接合条件下,接头的高温(973 K)剪切强度达到133 MPa。
- 扩散连接 /
- 界面反应 /
- 接合强度
Abstract: Pressureless-sintered SiC was joined to SiC using Fe-Ti alloy with diffusion bonding at temperature range 1473~1723 K and joining time 0.9~5.4 ks.The TiC、FeSi and Ti₅Si₃ phases were formed at the joint.The experimental results show ed that the shear strength of the joint,which was bonded at 1623 K for 2.7 ks using Fe-50Ti (at%) alloy,was up to 133 MPa at the test temperature of 973 K.
- diffusion bonding /
- interface reaction /
- joining strength