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用Ti箔直接连接Al2O3/Cu

Bonding Al2O3 to Cu with Ti Foil

    摘要
  • 摘要: 借助SEM、EDX和XRD分析手段,对直接用Ti箔在1273K连接的Al2O3/Cu接头的连接界面微观结构进行了研究,分析了Ti箔厚度影响反应层厚度和连接强度的机制。

     

    Abstract: onding Al2O3 to Cu was performed by directly using Ti foil at 1273K.The microstructure of the joint interface was investigated by SEM.EDX and XRD analyses.The mechanism of the effects of Ti foil thickness on the reaction layer thickness and the joint strength was analyzed.

     

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