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K18合金等温凝固扩散焊及硼扩散行为的研究

THE TRANSIENT-LIQUID-PHASE BONDING OF SUPERALLOY K18 AND THE DIFFUSION BEHAVIOR OF ELEMENT BORON

  • 摘要: 本文对K18合金等温凝固扩散焊接的工艺及元素的扩散行为进行了研究。采用等温凝固扩散焊工艺,解决了铸造高温合金熔化焊时产生热裂纹的问题。对元素的扩散现象,特别是硼的扩散现象进行了X射线分析和金相检验,进一步证实了以M3B2型存在的硼化物促进了σ相的形成.影响K18合金扩散过程的关键是控制硼的扩散.试验证明.只是在等温凝固扩散焊接过程的后期,硼的扩散才比较接近Fick定律.等温凝固扩散焊对不易熔焊的高温合金提供了可靠的焊接方法.它不但可焊同种材料,还可焊异种材料.

     

    Abstract: The technology of transient-liquid-phase(TLP) bonding of superalloy K18 and the behavior of its elements during the diffusion process had been studied.By applying this diffusion bonding technique (with isothermal solidification),the authors solved the problem of hot cracking in the fusion welding of cast Ni-base K18 high temperature alloy.The diffusion behavior of the elements,particularly boron,was carefully investigated.Autoradiographic and metallographic findings confirmed that boron in the form of M3B2 promoted the formation of σ-phase.The key to the successful bonding of K18 alloy was to control the diffusion of boron.Not until the later stage of the isothermal solidification diffusion bonding process did the diffusion of boron follow roughly Fick's law.TLP bonding helped a lot in joining difficult to weld high temperature alloys.It could be also considered as a potential means of making joints of dissimilar materials.

     

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