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Cu/V复合中间层对TC4/IN718激光焊接接头组织及性能的影响

Effect of Cu/V multi-interlayer on the microstructure and mechanical properties of TC4/IN718 joint by laser welding

  • 摘要: 为了实现TC4钛合金与GH4169镍基高温合金的有效连接.采用Cu/V复合中间层对TC4和IN718合金进行连续激光焊接,并分析添加中间层对接头裂纹、组织及力学性能的影响机制. 结果表明,常规激光焊接时,TC4/IN718接头焊缝区产生大量Ti-Ni脆性金属间化合物,导致接头形成大量纵向裂纹,焊缝组织为Ti(s,s) + Ti2Ni + Ti-Cr + NiTi + Ni3Ti + Cr(s,s). 当采用Cu/V复合中间层后,实现了TC4与IN718合金的有效连接,接头抗拉强度达到271MPa,焊缝组织转变为Ti(s,s) + V(s,s) + NiV3 + Cr(s,s) + Cu(s,s) + 未熔铜.

     

    Abstract: In order to realize the effective connection between TC4 and GH4169 alloy, the Cu/V multi-interlayer was applied to join TC4 and IN718 alloy by continuous laser welding. The regulating mechanism of the Cu/V multi-interlayer on the cracks, microstructure and mechanical properties of TC4/IN718 joint was analyzed. The results show that a large number of Ti-Ni brittle intermetallic compounds are generated in the weld area of TC4/IN718 joint with the conventional laser welding, resulting in the formation of a large number of longitudinal cracks in the joint. The microstructure structure of weld zone in the TC4/IN718 joint is comprised of Ti(s,s) + Ti2Ni + Ti-Cr + NiTi + Ni3Ti + Cr(s,s). When adopting the Cu/V multi-interlayer, the effective joining between TC4 and IN718 alloy is realized, the tensile strength of the joint reaches 271MP. The microstructure structure of weld zone in the TC4/ Cu/V/IN718 joint is transformed into Ti(s,s) + V(s,s) + NiV3 + Cr(s,s) + Cu(s,s) + unmelted copper.

     

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