Abstract: Utilizing the size effect of metal nanomaterials can significantly lower the bonding temperature and enhance the reliability of solder joints. Low temperature bonding metal nanomaterials, such as silver nano solder paste, have undergone extensive validation and mass production in the packaging of power devices, represented by third-generation semiconductors chips. However, when it comes to advanced packaging for integrated circuits that require patterned solder joints, the challenge lies in transferring power chip packaging technology to meet both low-temperature bonding and patterning bonding requirements, significantly increasing the technical complexity. This article begins by dissecting the fundamental scientific principles behind reducing bonding temperature through the utilization of metal nanomaterials. It then provides an extensive review of the current research status in low-temperature bonding with various nanomaterials. Finally, it focuses on summarizing patterning methods for bondable nanomaterials, offering technical insights for achieving precise spacing, high precision, and efficient graphical low-temperature bonding in advanced packaging.