Microstructural characteristics and properties of Cu@Ag NPs interconnect joints fabricated via ultrasound-assisted sintering
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摘要:
采用一种银铜两相的核壳结构材料—银包铜纳米颗粒(Cu@Ag NPs)配置焊膏，引入超声辅助烧结技术进行烧结，设计了3组参数试验，分别探究了烧结温度、超声时间和超声功率对互连接头的组织形貌和力学性能的影响.结果表明，烧结组织中银铜两相主要以置换固溶体的形式存在，随着超声作用的引入及烧结温度的上升，烧结组织的致密度增加，并最终在150 ~ 200 ℃形成较好的冶金结合，实现了低温连接. 超声时间由2 s增加到8 s， 超声功率由50 W增加到350 W，烧结组织逐渐变得致密、均匀；当超声能量过高时，烧结层出现了明显的塑性变形和裂缝. 在烧结温度150 ℃、超声时间6 s、超声功率250 W的条件下，获得了均匀致密的烧结组织，抗剪强度为149.5 MPa.
Abstract:Silver-coated copper nanoparticles (Cu@Ag NPs), a two-phase core-shell structured material, were incorporated into solder paste, and ultrasound-assisted sintering technology was employed for the sintering process. Three sets of parameter experiments were designed to investigate the effects of sintering temperature, ultrasound time, and ultrasound power on the microstructure and mechanical properties of interconnect joints. The results demonstrate that in the sintered structure, silver and copper phases primarily existed as a replacement solid solution. With the introduction of ultrasound and an increase in sintering temperature, the density of the sintered structure increased significantly, ultimately achieving superior metallurgical bonding at temperatures ranging from 150 to 200 ℃ , enabling low-temperature connections. As ultrasound time increased from 2 s to 8 s and ultrasound power increased from 50 W to 350 W, the resulting sintered structure gradually became denser and more uniform. However, excessive ultrasound energy led to noticeable plastic deformation and cracks within the sintered layer. When sintering temperature of 150 ℃ was applied along with an ultrasound time of 6 s and an ultrasound power of 250 W, a uniformly dense sintered structure with shear strength reaching up to 149.5 MPa was obtained.
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图 3 不同温度下UAS互连接头SEM微观形貌
Figure 3. SEM microstructure of UAS interconnect joints under different temperature. (a) 50 ℃; (b) 100 ℃; (c) 150 ℃; (d) 200 ℃
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图 4 不同超声时间UAS互连接头SEM微观形貌
Figure 4. SEM microstructure of UAS interconnect joints under different ultrasound time. (a) 2 s; (b) 4 s; (c) 6 s; (d) 8 s
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图 5 不同超声功率下UAS互连接头SEM微观形貌图
Figure 5. SEM microstructure of UAS interconnect joints under different ultrasound power. (a) 50 W; (b) 150 W; (c) 250 W; (d) 350 W
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图 6 不同温度UAS接头抗剪强度变化趋势
Figure 6. Shear strength variation trend of UAS joints at different temperature
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图 7 不同超声时间UAS接头抗剪强度变化趋势
Figure 7. Shear strength variation trend of UAS joints at different ultrasound time
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图 8 不同超声功率UAS接头抗剪强度变化趋势
Figure 8. Shear strength variation trend of UAS joints at different ultrasound power
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图 10 UAS界面组织及其EDS表征
Figure 10. Interface and EDS scanning mapping of UAS structure. (a) elemented mapping of Cu/Ag of sintering structure; (b) elemented mapping of Ag; (c) amplified SEM morphology; (d) elemented mapping of Cu/Ag corresponding to Fig.10c
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图 11 UAS工艺下基板跨界面元素分布
Figure 11. Elemental distribution at the interface between solder layer and substrate under UAS. (a) element line scanning; (b) elemental distribution
表 1 烧结工艺参数
Table 1 Sintering experiment parameters
焊件尺寸
mm × mm × mm烧结温度
T/℃超声时间
t/s超声功率
P/W5 × 5 × 0.5 50 4 250 5 × 5 × 0.5 100 4 250 5 × 5 × 0.5 150 4 250 5 × 5 × 0.5 200 4 250 5 × 5 × 0.5 150 2 250 5 × 5 × 0.5 150 6 250 5 × 5 × 0.5 150 8 250 5 × 5 × 0.5 150 4 50 5 × 5 × 0.5 150 4 150 5 × 5 × 0.5 150 4 350 
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表 2 UAS工艺界面EDS元素含量
Table 2 Element content of interface under UAS by EDS
位置 元素 Cu Ag 1 95.00 5.00 2 94.52 5.48 3 95.13 4.87 4 28.98 71.02 5 28.10 71.90 6 28.36 71.64
下载: 导出CSV
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