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柔性铜-银复合薄膜的激光直写制备及其导热特性

姚煜, 郭伟, 刘通, 周兴汶

姚煜, 郭伟, 刘通, 周兴汶. 柔性铜-银复合薄膜的激光直写制备及其导热特性[J]. 焊接学报, 2023, 44(12): 75-81. DOI: 10.12073/j.hjxb.20230613011
引用本文: 姚煜, 郭伟, 刘通, 周兴汶. 柔性铜-银复合薄膜的激光直写制备及其导热特性[J]. 焊接学报, 2023, 44(12): 75-81. DOI: 10.12073/j.hjxb.20230613011
YAO Yu, GUO Wei, LIU Tong, ZHOU Xingwen. Thermal conductivity of flexible Cu-Ag composite thin films by laser direct writing[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2023, 44(12): 75-81. DOI: 10.12073/j.hjxb.20230613011
Citation: YAO Yu, GUO Wei, LIU Tong, ZHOU Xingwen. Thermal conductivity of flexible Cu-Ag composite thin films by laser direct writing[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2023, 44(12): 75-81. DOI: 10.12073/j.hjxb.20230613011

柔性铜-银复合薄膜的激光直写制备及其导热特性

基金项目: 中国博士后科学基金(2023M732524);江苏省自然科学基金(BK20230497);江苏省卓越博士后计划(2023ZB548).
详细信息
    作者简介:

    姚煜,硕士;主要研究方向为微纳连接制造、铝合金CMT电弧增材制造技术;Email:18811571011@163.com

    通讯作者:

    周兴汶,博士;Email: xingwenzhou@suda.edu.cn

  • 中图分类号: TG 456

Thermal conductivity of flexible Cu-Ag composite thin films by laser direct writing

  • 摘要:

    随着柔性电子产品对高效热管理的需求不断增长,近年来制备高导电性柔性薄膜越来越受到人们的广泛关注. 以聚酰亚胺(PI)为基底,采用激光直写技术制备铜(Cu)和铜-银(Cu-Ag)薄膜,并对制备的Cu-Ag薄膜进行了物相分析和结构表征. 结果表明,铜纳米颗粒和银纳米线在激光辐照的作用下表面局部熔化,进而烧结;通过比较直写制备的铜薄膜和Cu-Ag薄膜在不同温度下7 天内电阻的变化,得出银的引入提高了复合材料整体的抗氧化性;对Cu/PI和Cu-Ag/PI两种复合材料的热扩散系数和热导率进行测试,得出银的引入提高了复合薄膜的热导率,Cu-Ag/PI薄膜表现出比Cu/PI薄膜更好的热性能. 为制备具有良好热稳定性的Cu /PI和Cu-Ag /PI复合材料提供了一种快速简便、经济节约的方法.

    Abstract:

    With the increasing demand of flexible electronic products for efficient thermal management, the preparation of flexible thin films with high conductivity has attracted more and more attention in recent years. Cu and Cu-Ag thin films are prepared by laser direct writing technique on polyimide (PI) substrate. The phase analysis and structure characterization of the two films show that the copper nanoparticles and silver nanowires are sintered by partial melting of their surface under laser irradiation. By comparing the resistance changes of prepared copper and Cu-Ag thin films at different temperatures for 7 days, it is concluded that the introduced silver improves the overall oxidation resistance of the composites. The thermal diffusivity and thermal conductivity of the two composites are tested, and it is found that the thermal conductivity of Cu-Ag/PI is significantly improved, showing better thermal performance than Cu/PI. This work provides a quick, simple and economical method for the preparation of Cu/PI and Cu-Ag/PI composites with good thermal stability.

  • 图  1   激光直写制备 Cu-Ag 薄膜过程示意图

    Figure  1.   Process of fabricating composite thin films by laser direct writing

    图  2   Cu和Cu-Ag薄膜数码照片以及Cu-Ag薄膜光镜形貌

    Figure  2.   Images of Cu and Cu-Ag thin films, and OM images of Cu-Ag thin films. (a) image of Cu thin film; (b) image of Cu-Ag thin film; (c) OM images of Cu-Ag thin film

    图  3   复合薄膜的XRD图谱和XPS图

    Figure  3.   XRD spectra and XPS spectra of different composite thin films. (a) XRD spectra of Cu and Cu-Ag thin films; (b) Cu 2p3/2 spectra; (c) Ag 3d spectra; (d) O 1s spectra

    图  4   Cu薄膜和Cu-Ag薄膜的SEM形貌

    Figure  4.   SEM images of Cu and Cu-Ag thin films. (a) SEM images of Cu thin films; (b) SEM image of lasal microstructure about Cu thin films; (c) SEM images of Cu-Ag thin films

    图  5   Cu-Ag薄膜的EDS图谱

    Figure  5.   EDS mapping images of Cu-Ag thin films

    图  6   Cu-Ag复合薄膜的TEM图

    Figure  6.   TEM images of Cu-Ag composite thin films: (a) interface of Cu-Cu; (b) typical single Ag nanowire; (c) TEM images of typical single Ag nanowire; (d) interface of Cu-Ag

    图  7   Cu /PI和Cu-Ag/PI复合薄膜的导热特性

    Figure  7.   Thermal properties of Cu /PI and Cu-Ag/PI composite thin films. (a) relative resistance changes of Cu and Cu-Ag composite film at different temperatures; (b) thermal diffusion coefficient and thermal conductivity of different materials; (c) thermal images of ceramic heater on Cu-based/PI composite films

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出版历程
  • 收稿日期:  2023-06-12
  • 网络出版日期:  2023-11-30
  • 刊出日期:  2023-12-24

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