Growth behavior of inter metallic compounds at N06200 nickel alloy and S32168 stainless steel
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摘要:
研究了N06200镍基合金与S32168不锈钢TIG焊接接头经焊后热处理后界面金属间化合物(Intermetallic Compounds, IMCs)的演变过程，并从热力学和动力学的角度分析界面IMCs的生成种类、先后顺序及生长动力学模型. 结果表明，随着热处理温度的升高，接头的抗拉强度呈现先升高后降低的趋势；随着保温时间的增加，接头的抗拉强度随之增加. 随着热处理温度的升高和保温时间的延长，界面IMCs的厚度增加. 镍基合金与不锈钢界面IMCs主要由NiFe相、Ni2Cr相、FeCr相和Ni3Fe相组成，形成IMCs的顺序为NiFe→FeCr→Ni2Cr→Ni3Fe. 界面IMCs的增长符合抛物线规律，经线性回归方法计算得出界面IMCs的生长动力学模型为 W=1.725 × 10−13·
$e^{[-45.98 /(R T)] \cdot t^{1 / 2}} $ .Abstract:The evolution process of IMCs at the interface between N06200 nickel-base alloy and S32168 stainless steel TIG welded joint after post-weld heat treatment was analyzed. The formation type, sequence and growth kinetics model of IMCs at the interface were analyzed through the perspective of thermodynamics and kinetics. The results showed that with the increase of heat treatment temperature, the tensile strength of the welding joint increases firstly and then decreases. With the increasing of holding time, the tensile strength of the joint increased. The IMCs at the interface between nickel base alloy and stainless steel after welding heat treatment were mainly composed of NiFe phase, Ni2Cr phase, FeCr phase and Ni3Fe phase. The thickness of IMCs layer at the interface increase with the increasing of heat treatment temperature and holding time. The formation sequence of IMCs was NiFe→FeCr→Ni2Cr→Ni3Fe. The growth of IMCs was in line with parabolic law. The kinetic model of IMCs was W=1.725 × 10−13·
$e^{[-45.98 /(R T)] \cdot t^{1 / 2}} $ . by linear regression method.-
Keywords:
- nickel-base alloy /
- stainless steel /
- IMCs /
- thermodynamics /
- kinetics
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图 2 母材金相组织
Figure 2. Micro structure of base metal. (a) N06200 nickel base metal; (b) S32168 stainless steel
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图 3 界面组织微观形貌及EDS分析结果
Figure 3. The SEM and EDS of interface micro structure. (a) SEM; (b) EDS linear scan
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图 4 不同热处理温度下界面SEM图像
Figure 4. SEM images of interface after different heat treatment temperature. (a) 1000 ℃; (b) 1050 ℃; (c) 1100 ℃; (d) 1150 ℃
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图 6 不同热处理温度下接头的抗拉强度
Figure 6. Tensile strength of joints at different heat treatment temperature
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图 8 界面各种IMCs的吉布斯自由能与温度的关系
Figure 8. Relationship between Gibbs free energy and temperature for different IMCs at N06200 and S32168
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图 9 界面IMCs层的厚度与退火温度及保温时间的关系
Figure 9. Relationship between IMCs layer thickness and annealing temperature or holding time
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图 10 焊接界面 IMCs 层生长速度的 Arrhenius 图
Figure 10. Arrhenius graph of growth rate of IMCs layer
表 1 N06200母材、S32168母材及焊丝ERNiCrMo-17化学成分(质量分数，%)
Table 1 Chemical compositions of N06200, S32168 and ERNiCrMo-17
材料 Cr Mo Cu Mn C Si S P Ti Ni Fe N06200 23.00 16.00 1.60 0.19 ≤0.010 ≤0.08 ≤0.010 ≤0.020 — 余量 — S32168 18.12 — — 1.90 0.050 0.62 0.012 0.015 0.60 10.89 余量 ERNiCrMo-17 23.30 16.47 1.57 0.09 0.008 0.01 0.001 0.001 — 余量 — 
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表 2 N06200镍基合金与S32168不锈钢TIG焊接工艺参数
Table 2 TIG Welding parameter of N06200 nickel alloy and S32168 stainless steel
层次 焊接方法 焊材 规格 焊接电流I/A 电弧电压U/V 焊接速度v/(mm·min−1) 1 TIG ERNiCrMo-17 ϕ2.0 mm 100～120 15～17 70～90 2 130～150 15～17 80～100
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表 3 图4中特殊位置的EDS点扫描结果
Table 3 EDS analysis results of the points showing in Fig.4
位置 元素含量w(质量分数, %) 相组成 Ni Fe Cr 1 76.94 0.36 22.70 Ni 2 47.89 50.24 1.87 NiFe 3 46.85 45.28 7.87 NiFe 4 7.69 75.48 16.83 Fe 5 46.54 44.58 8.88 NiFe 6 48.52 46.50 4.98 NiFe 7 7.78 47.64 44.48 FeCr 8 65.35 2.17 32.48 Ni2Cr 9 51.33 44.28 4.39 NiFe 10 72.41 25.10 2.49 Ni3Fe 11 48.29 47.56 4.15 NiFe
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表 4 焊接界面IMCs在不同热处理温度下的生长率常数
Table 4 Calculated growth rate constants of interface IMCs at different heat treatment temperatures
温度T/K 生长率系数k/(10−13m2·s−1) 时间指数n 1273 2.02 0.489 1323 2.60 0.496 1373 3.17 0.519 1423 3.76 0.492
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