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N06200镍基合金与S32168不锈钢界面金属间化合物的生长行为

Growth behavior of inter metallic compounds at N06200 nickel alloy and S32168 stainless steel

  • 摘要: 研究了N06200镍基合金与S32168不锈钢TIG焊接接头经焊后热处理后界面金属间化合物(Intermetallic Compounds, IMCs)的演变过程,并从热力学和动力学的角度分析界面IMCs的生成种类、先后顺序及生长动力学模型. 结果表明,随着热处理温度的升高,接头的抗拉强度呈现先升高后降低的趋势;随着保温时间的增加,接头的抗拉强度随之增加. 随着热处理温度的升高和保温时间的延长,界面IMCs的厚度增加. 镍基合金与不锈钢界面IMCs主要由NiFe相、Ni2Cr相、FeCr相和Ni3Fe相组成,形成IMCs的顺序为NiFe→FeCr→Ni2Cr→Ni3Fe. 界面IMCs的增长符合抛物线规律,经线性回归方法计算得出界面IMCs的生长动力学模型为 W=1.725 × 10−13·e^-45.98 /(R T) \cdot t^1 / 2 .

     

    Abstract: The evolution process of IMCs at the interface between N06200 nickel-base alloy and S32168 stainless steel TIG welded joint after post-weld heat treatment was analyzed. The formation type, sequence and growth kinetics model of IMCs at the interface were analyzed through the perspective of thermodynamics and kinetics. The results showed that with the increase of heat treatment temperature, the tensile strength of the welding joint increases firstly and then decreases. With the increasing of holding time, the tensile strength of the joint increased. The IMCs at the interface between nickel base alloy and stainless steel after welding heat treatment were mainly composed of NiFe phase, Ni2Cr phase, FeCr phase and Ni3Fe phase. The thickness of IMCs layer at the interface increase with the increasing of heat treatment temperature and holding time. The formation sequence of IMCs was NiFe→FeCr→Ni2Cr→Ni3Fe. The growth of IMCs was in line with parabolic law. The kinetic model of IMCs was W=1.725 × 10−13·e^-45.98 /(R T) \cdot t^1 / 2 . by linear regression method.

     

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