Wetting and spreading mechanism of CuSn pre-alloyed powder-cored composite silver solder
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摘要: 研究了添加质量分数为30% ~ 70% CuSn预合金粉复合银钎料在T2紫铜基体上的润湿铺展过程，并讨论了CuSn预合金粉复合银钎料在紫铜基体上的润湿铺展机理.结果表明,在与紫铜基体的润湿铺展过程中，初始接触角由30%CuSn 的119°降低到70%CuSn 的94°.最终接触角由30%CuSn 的15°下降到70%CuSn 的7°. 当粉芯中CuSn合金粉含量为60%时，钎料在铜板上的润湿面积达到530.04 mm2，相比于未添加CuSn合金粉时提高了约66%.由于低熔点CuSn预合金粉的前驱润湿作用使复合银钎料表面张力降低，初始接触角和最终接触角随着CuSn预合金粉含量的增加而减小. CuSn预合金粉在钎焊过程中先于BAg30CuZnSn钎料外皮熔化，形成熔融的铜锡液态合金薄层，降低了固液界面张力.随后，熔化的BAg30CuZnSn箔带在先期熔化的铜锡液态薄层上铺展，并与其发生溶质原子的扩散反应，最终形成液态复合钎料. 低熔点CuSn预合金粉的加入，使复合银钎料在铜上的润湿性能显著改善. 添加40%CuSn预合金粉复合银钎料与铜基体的反应润湿界面均匀致密，其中白色富Ag相互连接，Sn元素主要分布于富Ag相和周围的锡青铜相中.Abstract: In this paper, the wetting and spreading process of 30% − 70% CuSn pre-alloyed powder composite silver solder on T2 copper matrix was studied, and the wetting and spreading mechanism of CuSn pre-alloyed powder composite silver solder on copper matrix was discussed. The results show that the initial contact angle decreases from 119° for 30% CuSn to 94° for 70% CuSn during the wetting and spreading process with the copper substrate. The final contact angle decreased from 15° for 30% CuSn to 7° for 70% CuSn. When the content of CuSn alloy powder in the powder core is 60%, the wetting area of the solder on the copper plate reaches 530.04 mm2, an increase of about 66% compared to when no CuSn alloy powder was added. The initial and final contact angles decreased with the increase of CuSn pre-alloy powder content due to the precursor wetting effect of the low melting point CuSn pre-alloy powder, which melted on the outer skin of BAg30CuZnSn brazing material during the brazing process, forming a thin layer of molten CuSn liquid alloy and reducing the solid-liquid interfacial tension. Subsequently, the molten BAg30CuZnSn foil strip spreads over the pre-melted CuSn liquid thin layer and reacts with it by diffusion of solute atoms, eventually forming a liquid composite braze. The addition of the low melting point CuSn pre-alloyed powder improves the wetting performance of the composite silver brazing material on copper significantly. The reaction wetting interface of the composite silver braze with the copper substrate is uniform and dense with the addition of 40% CuSn pre-alloyed powder, where the white Ag-rich phases are interconnected and the Sn elements are mainly distributed in the Ag-rich phase and the surrounding tin bronze phase.
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Keywords:
- silver solder /
- CuSn pre-alloy /
- spreading area /
- interfacial structure /
- wetting mechanism
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图 1 复合粉芯药芯银钎料截面示意图
Figure 1. Cross section diagram of composite powder cored silver based filler metal
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图 2 不同CuSn预合金粉含量下银钎料接触角变化规律
Figure 2. Change law of contact angle of silver solder with different CuSn pre-alloyed powder
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图 3 接触角随CuSn预合金粉含量的变化规律
Figure 3. Variation of contact angle with CuSn pre-alloyed powder content
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图 4 CuSn粉含量对铺展面积的影响
Figure 4. Effect of CuSn pre-alloyed powder content on the spreading areas
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图 5 CuSn预合金粉含量对复合银钎料铺展形貌的影响
Figure 5. Effect of CuSn pre-alloyed powder content on the spreading morphology of composite silver filler metal. (a) 0%CuSn; (b) 30%CuSn; (c) 40%CuSn; (d) 50%CuSn; (e) 60%CuSn; (f) 70%CuSn
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图 6 40%CuSn粉芯复合银钎料在铜板上的润湿铺展过程
Figure 6. Wetting and spreading process of 40%CuSn powder cored composite silver filler metal on the copper plate
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图 7 润湿界面微观组织和铺展过程示意图
Figure 7. Microstructure at the interface after wetting and schematic diagram of the spreading process. (a) microstructure at the interface after wetting; (b) spreading process during the first stage; (c) spreading process during the second stage
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图 8 40%CuSn粉芯复合钎料与铜基体润湿界面的元素分布
Figure 8. Element distribution at the interface between composite silver based filler metal with 40% CuSn pre-alloyed powder core and the copper matrix. (a) microstructure of wet interface; (b) distribution of Ag element; (c) distribution of Cu element; (d) distribution of Zn element; (e) distribution of Sn element; (f) distribution of all element
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