高级检索

焊接时间及焊接温度对Sn35Bi0.3Ag/Cu焊接接头性能的影响

Effect of welding time and temperature on properties of Sn35Bi0.3Ag/Cu welded joints

  • 摘要: 分别在不同焊接时间和不同焊接温度下制备了Sn35Bi0.3Ag/Cu焊接接头,采用扫描电子显微镜(SEM)、万能拉伸试验机、超声波成像无损探伤检测仪等测试手段,研究了焊接时间(1 ~ 9 min)和焊接温度(210 ~ 290 ℃)对Sn35Bi0.3Ag/Cu焊接接头微观结构和力学性能的影响. 结果表明,在焊接过程中,Cu元素扩散到焊接界面处,形成了(Cu6Sn5, Cu3Sn)界面层,同时发现生成的Ag3Sn相能够抑制界面层的生长. 随着焊接时间的延长或焊接温度的升高,反应层变厚,抗剪强度先增大后减小. 对焊接接头断口形貌分析发现,焊接接头的断裂由Bi相颗粒及Cu6Sn5颗粒共同作用. 焊接接头的断裂发生在IMC/焊料一侧,Bi相颗粒及Cu6Sn5颗粒共同影响着接头的抗剪强度. 此外,当焊接时间为3 min、焊接温度为230 ℃时,接头的钎着率最大,为99.14%,抗剪强度达到最大值,为51.8 MPa.

     

    Abstract: Sn35Bi0.3Ag/Cu welded joints were prepared at different welding time and temperature. The effects of welding time (1 ~ 9 min) and welding temperature (210 ~ 290 ℃) on the microstructure and mechanical properties of Sn35Bi0.3Ag/Cu welded joints were studyed by means of scanning electron microscope (SEM), universal tensile testing machine and ultrasonic scan machine. The results show that the Cu element diffuses into the welding interface and forms the (Cu5Sn6, Cu3Sn) interface layer. The Ag3Sn phase can inhibit the growth of interfacial layer. With the increase of welding time or welding temperature, the reaction layer thickens and the shear strength increases first and then decreases. The analysis of the fracture morphology of the welded joint shows that the fracture of the welded joint is jointly affected by Bi phase particles and Cu6Sn5 particles.The fracture of the welded joint occurs on the IMC / solder side. Bi phase particles and Cu6Sn5 particles affect the shear strength of the joint.In addition, when the welding time is 3 min and the welding temperature is 230 ℃, the brazing rate is the highest (99.14%) and the shear strength reaches the maximum value (51.8 MPa).

     

/

返回文章
返回