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Ag-Cu固溶体颗粒制备及低温烧结互连接头性能

Preparation of Ag-Cu solid solution nanoparticles and the properties of low temperature sintered interconnect joint

  • 摘要: 通过液相化学还原法制备Ag-Cu固溶体纳米颗粒,采用低温热压烧结工艺制备“三明治”结构的互连接头.采用X射线衍射仪对所制备的Ag-Cu固溶体纳米颗粒及烧结体进行物相表征;采用能谱仪对所制备的Ag-Cu固溶体纳米颗粒的元素进行表征;采用纳米粒度仪对Ag-Cu固溶体纳米颗粒粒径进行表征;通过扫描电子显微镜对互连接头的烧结组织和剪切断面形貌进行观察,分析颗粒烧结情况和互连接头断裂模式. 结果表明,通过液相化学还原的方法实现了室温下铜在银中的超饱和固溶,其中Ag原子分数为62.29%,Cu原子分数为37.71%,远超常温下常规块体材料的固溶度. 所制备的纳米颗粒在250 ℃以内保持相对稳定的固溶体相,260 ℃时发生相分离. 当烧结温度为300 ℃、烧结压力20 MPa时,所获得的互连接头具有优异的力学性能,平均抗剪强度达到105 MPa,且烧结组织呈现完整的脉络状,剪切断面全部为韧窝状,属于韧性断裂.

     

    Abstract: Ag-Cu solid solution nanoparticles were prepared by liquid phase chemical reduction, and sandwich joints were prepared by low temperature hot pressing sintering process. The phase characterization of Ag-Cu solid solution nanoparticles and sinter was detected by X-ray diffraction. The elements of Ag-Cu solid solution nanoparticles prepared were characterized by energy disperse spectroscopy. The particle size of Ag-Cu solid solution nanoparticles was characterized by nanometer. The sintering structure and shear section morphology of the interconnect joints were observed by scanning electron microscopy, and the particle sintering situation and fracture mode of the interconnect joints were analyzed. The results showed that the supersaturated solid solution of Cu in Ag at room temperature was realized by liquid phase chemical reduction, in which the percentage of Ag atoms and Cu atoms was 62.29% and 37.71%, far exceeding the solid solution of conventional block materials at room temperature. The solid solution phase remained relatively stable within 250 ℃, and phase separation occurred at 260 ℃.When the sintering temperature is 300 ℃ and the sintering pressure is 20 MPa, the interconnect joints obtained have excellent mechanical properties, the average shear strength reaches 105 MPa, the sintered structure shows a complete vein shape, and the shear sections are all dimpled, which belong to ductile fracture.

     

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