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Al-60Si合金低温超声波辅助钎焊接头微观组织与力学性能

Microstructure and mechanical properties of ultrasonic assisted soldering joint of Al-60Si alloy at low temperature

  • 摘要: 采用SnAgCu钎料对Al-60Si合金进行了超声波辅助低温钎焊,发现Ag元素可以与Al元素结合形成一层Ag2Al,促进钎料对母材的润湿和溶解.研究了钎焊温度及超声波作用时间对接头力学性能与微观组织的影响. 结果表明,随着钎焊温度的升高,钎缝中的硅颗粒平均质量分数随之增加,由焊接温度240 ℃时的1.11%提高至钎焊温度 360 ℃时的7.17%,接头抗剪强度呈先上升后降低的趋势,在330 ℃钎焊时达到最高,为42 MPa;当钎焊温度为330 ℃,将超声波施加时间从10 s增至70 s,钎缝中的硅颗粒平均质量分数从5.13%升至9.18%,接头抗剪强度呈现先提高后降低的趋势,在超声50 s时达到最高,为51 MPa.

     

    Abstract: Ultrasonic-assisted low-temperature brazing of Al-60Si alloy was carried out with SnAgCu solder. The effects of brazing temperature and ultrasonic time on the mechanical properties and microstructure of the joint were investigated. High (240 ℃ to 360 ℃), the average mass fraction of Si particles in the brazing joint increases (1.11% to 7.17%), and the shear strength of the joint increases first and then decreases. The highest value during welding is 42 MPa; when the brazing temperature is fixed at 330 ℃, and the time that ultrasonic waves are applied to the substrate is increased (from 10 s to 70 s), the average mass fraction of Si particles in the brazing seam increases accordingly (from 5.13% increased to 9.18%), the shear strength of the joint showed a trend of increasing first and then decreasing, reaching the highest at 51 MPa when ultrasonic for 50 s.

     

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