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SiO2-BN复相陶瓷润湿性及其接头微观组织

Study on the wettability and the microstructure of SiO2-BN multiphase ceramics

  • 摘要: 采用座滴法开展Ag-21Cu-4.5Ti合金钎料对SiO2-BN复相陶瓷润湿与铺展行为研究. 利用SEM、XRD分析润湿界面微观组织以及形成机理. 通过调控SiO2-BN复相陶瓷中BN含量,研究Ag-21Cu-4.5Ti/SiO2-BN复相陶瓷润湿体系的润湿模型. 结果表明,Ag-21Cu-4.5Ti/SiO2-BN复相陶瓷润湿体系的典型界面反应产物为TiN和TiB2,随着体系BN含量的增加,润湿性逐渐变好. 对SiO2-BN复相陶瓷与Nb进行钎焊试验,典型界面组织为SiO2-BN复相陶瓷/TiN + TiB2/Ti2Cu + (Ag,Cu)/(βTi,Nb)/Nb. 接头抗剪强度随着钎焊时间升高先增大后减小,当钎焊温度为880 ℃,保温时间10 min时,钎焊接头抗剪强度最高,到达39 MPa.

     

    Abstract: The wetting and spreading behavior of SiO2-BN multiphase ceramics by Ag-21Cu-4.5Ti alloy filler was studied using the base drop method. The microstructure and the formation mechanism of wetting interface were analyzed by SEM and XRD. The relationship among BN content and wetting and spreading behavior was established. The results showed that the typical interface reaction products of Ag-21Cu-4.5Ti/SiO2-BN were TiN and TiB2, and the wettability gradually improved with the increasing of BN content in the system. The SiO2-BN multiphase ceramics were brazed to the Nb. The typical interface structure was SiO2-BN multiphase ceramics/TiN + TiB2/Ti2Cu + (Ag,Cu)/(Ti,Nb)/Nb. The shear strength of the joint first increases and then decreases with the increasing of brazing temperature. When the brazing temperature was 880 ℃ and the holding time was 10min, the shear strength of the brazed joint was 39 MPa.

     

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