Research on reliability of CCGA reinforcement process for aerospace electronic products
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摘要: 航天电子产品大量应用陶瓷柱栅阵列封装(ceramic column grid array, CCGA)器件，其装焊质量与器件本体尺寸和加固工艺息息相关.文中通过试验和数值仿真方法，研究印制电路板(primted circurt board, PCB)约束、器件加固工艺对大尺寸CCGA焊点可靠性的影响. 仿真与试验结果表明，优化CCGA周围印制电路板约束方式、使用EC-2216环氧胶加固CCGA均可大幅降低随机振动过程中焊点受力. 使用少量环氧胶加固CCGA提高焊点抗振性能的同时，对焊点抗热疲劳性能影响较小，满足QJ 3086A—2016高可靠装焊要求；随着环氧胶点胶量的增多，焊点抗热疲劳性能显著下降，焊点在温差变化较大的服役环境下存在失效风险；在充分优化PCB约束以降低板级振动响应的情况下，使用GD414硅橡胶加固器件也满足航天电子产品高可靠装配要求.
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关键词:
- 陶瓷柱栅阵列封装器件 /
- 机械应力 /
- 热疲劳失效 /
- 可靠性
Abstract: Ceramic column grid array packaging device (CCGA) are widely used in aerospace electronic products. The assembly and welding quality of CCGA is closely related to the device size and reinforcement process. This paper studied the effects of primted circurt board (PCB) constraints and CCGA reinforcement process on solder joint reliability by experiment and numerical simulation. The results show that optimized PCB restraint and using EC-2216 epoxy adhesive to strengthen CCGA can significantly reduce solder joint stress during random vibration. After reliability tests, using a small amount of EC-2216 epoxy adhesive to strengthen CCGA meets the reliability requirements of QJ 3086A—2016, the vibration resistance of solder joint is improved, and it has little influence on the thermal fatigue resistance. With the increase of epoxy adhesive amount, the thermal fatigue resistance of solder joints decrease significantly, and the high failure risk of solder joints exists in the service environment with large temperature difference. Under the condition of fully optimizing PCB board level constraints, using GD414 silicone rubber to reinforce the CCGA meets the high reliability assembly requirements of aerospace electronics. The above results provide reference for the reinforcement process of CCGA. -
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图 4 2号、4号、6号和7号样件振动后焊点情况
Figure 4. Solder joints of No.2, No.4, No.6, No.7 sample after vibration experiment
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图 5 各模型z向瞬时变形曲线和测量点实测PSD曲线
Figure 5. Transient deformation simulation results and experimental PSD curves. (a) instantaneous deformation curves of direction z; (b) measured PSD curve of RM1; (c) measured PSD curve of RM2
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图 6 各模型随机振动RMIS仿真结果
Figure 6. RMIS simulation results of various random vibration model. (a) RMIS curve of simulation models; (b) RMIS distribution cloud map of RM1; (c) RMIS distribution cloud map of RM2; (d) RMIS distribution cloud map of RM3
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图 7 1号、3号、5号和7号样件温度循环后焊点形貌
Figure 7. Solder joints of No.1 , No.3 , No. 5, No.7 sample after temperature-cycle experiment
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图 8 各样件CCGA热循环高温和低温热应力分布云图
Figure 8. Thermal stress distribution of CCGA solder joints at high temperature and low temperature. (a) No.1 sample; (b) No.3 sample; (c) No.5 sample
表 1 随机振动试验条件
Table 1 Random vibration test conditions
频率
f/Hz功率谱密度M 总均方根加速度
a(Grms)dB/oct g2/Hz 20 ~ 60 + 3 60 ~ 1 000 0.27 20 1 000 ~ 2 000 − 6 
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表 2 CCGA样件的分配
Table 2 Distribution of the CCGA samples
约束状态 器件点胶状态 振动样件编号 温度循环样件编号 A ① 2 1 B ② 4 3 ③ 6 5 ④ 7 7
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表 3 各材料主要参数
Table 3 Main parameters of materials
材料(常温) 密度
ρ/(g·cm−3)热膨胀系数
γ/(10−6℃−1)弹性模量
E/GPaFR-4(PCB) 2.6 15 ~ 17 20 CCGA陶瓷 3.5 6.5 400 9010焊柱 8.3 24 13 ~ 15 EC-2216环氧 2.1 60 ~ 70 18 ~ 20
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