Research on the spreading of Sn-9Zn solder on SiC surface under the effect of electromagnetic ultrasound
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摘要: 基于Comsol Multiphysics软件，通过建立电磁超声辅助钎焊模型，研究洛伦兹力作用下钎料Sn-9Zn在SiC陶瓷表面的铺展行为. 结果表明，在电磁超声作用下，钎料表面出现塌陷并向外铺展，伴随着钎料表面出现振动现象，随后线圈下方的部分钎料断裂并飞溅，中心处钎料收缩. 当线圈通入交变电流时，在周边感生出方向呈周期性转换的交变磁场. 钎料内部洛伦兹力方向整体指向钎料外部，在钎料边缘处逐渐指向母材表面，线圈下方钎料所受水平和垂直方向的洛伦兹力高于其它部分，最高时分别为63.96 和31.2 kN/m3，顶部钎料在洛伦兹力、压力差和“坍塌效应”的共同作用下，促进钎料铺展.Abstract: Based on Comsol Multiphysics software, an electromagnetic ultrasonic-assisted brazing model was established to study the spreading behavior of solder Sn-9Zn on the surface of SiC ceramics under the action of Lorentz force. It spreads out, accompanied by the vibration phenomenon on the surface of the solder, and then part of the solder under the coil breaks and splashes, and the solder shrinks in the center. When the coil is fed with an alternating current, an alternating alternating current with a periodic change in direction is induced around the coil. Magnetic field. The direction of the Lorentz force inside the solder points to the outside of the solder as a whole, and gradually points to the surface of the base metal at the edge of the solder. The horizontal and vertical Lorentz forces of the solder under the coil are higher than other parts, and the highest respectively are 63.96 and 31.2 kN/m3, the top brazing filler metal promotes brazing filler metal spreading under the combined action of Lorentz force, pressure difference and "collapse effect".
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Keywords:
- electromagnetic ultrasound /
- magnetic field /
- Lorentz force /
- spread
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图 2 二维轴对称几何模型示意图
Figure 2. Schematic diagram of two-dimensional axisymmetric geometric model
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图 3 交变磁场的磁感应分布情况
Figure 3. Distribution of magnetic induction of alternating magnetic field. (a) t = T/6; (b) t = 2T/6; (c) t=3T/6; (d) t = 4T/6; (e) t = 5T/6; (f) t = 6T/6
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图 5 电磁超声作用下钎料的铺展过程
Figure 5. Spreading process of the solder under the action of electromagnetic ultrasound. (a) 0 ms; (b) 11 ms; (c) 25 ms; (d) 38 ms; (e) 42 ms; (f) 44 ms
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图 7 钎料表面沿x方向的洛伦兹力分布
Figure 7. Lorentz force distribution along the x direction on the surface of the solder
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图 8 钎料表面沿y方向的洛伦兹力分布
Figure 8. Lorentz force distribution along the y direction on the surface of the solder
表 1 SiC陶瓷的物理性能
Table 1 Physical properties of SiC
弹性模量E1/GPa 泊松比 $\gamma $ 密度ρ1/(g·cm−3) 450 0.142 3.1 
下载: 导出CSV
表 2 金属Sn-9Zn的物理性能
Table 2 The physical properties of Sn-9Zn
熔点T/℃ 粘度σ/(MPa·s) 密度ρ2/(g·cm−3) 198.6 1.62(220 ℃) 5.904
下载: 导出CSV
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