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热模拟MHC/GH4099扩散钎焊接头的组织与力学性能

Microstructure and mechanical properties of thermal simulated MHC/GH4099 diffusion brazing joints

  • 摘要: 采用NiCrSiB中间层在热模拟机上成功实现了难熔合金钼-铪-碳(MHC)与镍基高温合金GH4099的真空扩散连接;通过扫描电子显微镜(SEM)、能谱仪(EDS)和X射线衍射(XRD)对接头的微观组织进行表征;同时研究了不同连接温度对接头组织和力学性能的影响. 结果表明,在950,1000和1 050 ℃保温600 s时均可获得可靠的焊接接头;MHC/GH4099接头主要由γ-Ni基固溶体、CrMo固溶体、NiMo,CrB以及Ni3Si等相组成;在1 050 ℃焊接时,接头室温抗剪强度最高,可达116 MPa. MHC侧焊接热影响区存在较大的焊后应力集中,是引起接头发生脆性断裂的主要原因.

     

    Abstract: The molybdenum alloy (MHC) and the nickel alloy (GH4099) were successfully joined with NiCrSiB as the interlayer by the Gleeble-3800 thermal simulated machine. Microstructure of MHC/GH4099 welded joints were characterized by scanning electron microscope (SEM), energy dispersive scanning (EDS) and X-ray diffraction (XRD). The effects of bonding temperature on microstructure and shear strength were also investigated. Results indicated that a reliable welded joint can be obtained at peak temperatures of 950 ℃, 1 000 ℃ and 1 050 ℃ and holding time of 600 s. The MHC/GH4099 joints were mainly composed of γ-Ni solid solution, CrMo solid solution, MoNi and CrB, Ni3Si phase. The shear strength of the joint at 1 050 ℃ can reach 116 MPa. The larger stress concentration in the heat affected zone of MHC side was the main reason of brittle fracture for MHC/GH4099 joints.

     

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