Effect of heat treatment on microstructure and high temperature properties of IC10 superalloy TLP diffusion welding under 80 μm gap
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摘要: 采用瞬间液相扩散焊技术焊接了80 μm间隙下的IC10高温合金，利用扫描电镜(SEM/EDS)、纳米压痕仪及高温拉伸试验机对热处理前后IC10接头焊缝组织形貌、弹性模量、显微硬度、高温拉伸、高温持久性能及接头断口形貌进行了测试. 结果表明，当采用SBM-3作为中间焊料，焊缝间隙尺寸为80 μm时，在1 250 ℃，5 MPa，6 h的焊接工艺条件下，焊缝组织与母材组织形貌成分相近. 经过热处理后，测得其在1 100 ℃的温度下，抗拉强度可达268 MPa，高于母材(275 MPa)的97.5%；对焊缝的高温持久性能进行了检测，测得其在温度1 100 ℃，应力为36 MPa的条件下，焊缝持久寿命大于117 h，高于母材的90%. 在接头结构中，较大体积浓度的γ + γ′相存在于焊缝中，接头结构由母材平稳过渡到焊接接头. 高温拉伸及高温持久试验中裂纹从硼化物和碳化物的边缘以及γ + γ′共晶边缘处的微孔扩展. 热处理提高了母材弹性模量的同时降低了焊缝的弹性模量，接头弹性模量的降低提高了TLP扩散焊接头的高温力学强度.Abstract: The IC10 superalloy with 80 μm gap was welded by TLP diffusion welding. The microstructure, morphology, modulus of elasticity, microhardness, high temperature tensile strength, high temperature durability and fracture morphology before and after heat treatment of IC10 joints were tested by using scanning electron microscopy (SEM/EDS), nano-indenter and high-temperature tensile testing machine. The results showed that when SBM-3 was used as the intermediate solder and the gap size of the weld was 80 μm, under the welding process conditions of 1 250 ℃, 5 MPa, and 6 h, the morphology and base composition of the weld seam and the base metal were similar. After heat treatment, the tensile strength was 268 MPa, which higher than 97.5% of base metal (275 MPa) at the test temperature of 1 100 ℃. The high temperature durability of the IC10 joints were tested, the creep time of the joints was more than 117 h under the condition of the temperature of 1 100 ℃ and the stress of 36 MPa, which was higher than 90% of the base material. In the joint structure, a larger volume of γ + γ′ phase existed in the weld, and the joint structure transitioned smoothly from the base material to the welded joints. In high-temperature tensile and high-temperature durability tests, cracks started to expand from at the edge of the borides and carbides as well as the edge of the γ + γ′ eutectic. Heat treatment increased the elastic modulus of the base material while reduced the elastic modulus of the weld. The reduction of the joint elastic modulus improves the high-temperature mechanical strength of the TLP diffusion welded joints.
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图 2 接头微观组织形貌
Figure 2. Microstructure of the TLP-bonded joints. (a) before heat treatment; (b) after heat treatment
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图 3 热处理前后接头 1 100 ℃高温抗拉强度
Figure 3. 1 100 ℃ high temperature tensile strength of joints before and after heat treatment
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图 4 热处理前后接头 1 100 ℃/36 MPa的持久寿命
Figure 4. Creep rupture life of joints at 1 100 ℃/36 MPa before and after heat treatment
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图 5 热处理前1 100 ℃高温拉伸断口纵剖面
Figure 5. High temperature tensile fracture profile of 1 100 ℃ before heat treatment
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图 6 热处理前接头拉伸断口形貌
Figure 6. Tensile fracture of joint before heat treatment. (a) macro morphology; (b) marked area in Fig. 6a; (c) enlarged area in Ⅰ; (d) enlarged area in Ⅱ
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图 7 热处理后接头1 100 ℃高温拉伸断口纵剖面
Figure 7. 1 100 ℃ high temperature tensile fracture profile joints after heat treatment
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图 8 热处理后接头高温拉伸断口
Figure 8. High temperature tensile fracture of joints after heat treatment (BSE). (a) macro morphology; (b) expend map of marked area
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图 9 热处理前高温持久试验后接头形貌
Figure 9. Joint morphology after high temperature endurance test before heat treatment
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图 10 热处理前高温持久接头组织(SEM)
Figure 10. Microstructure of high temperature durable joint before heat treatment (SEM). (a) feature topography area; (b) carbide agglomeration phase (low power); (c) carbide agglomeration phase (high power); (d) structure morphology under high magnification
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图 11 热处理后的接头高温持久断口形貌
Figure 11. High-temperature permanent fracture morphology of joints after heat treatment. (a) longitudinal section of joint high temperature durable fracture; (b) feature morphology Ⅰ; (c) feature morphology Ⅱ
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图 12 纳米压痕试验
Figure 12. Nanoindentation test. (a) SEM image of typical region of TLP diffusion welded joint; (b) schematic diagram of position of nanoindentation array
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图 13 热处理前后纳米压痕测试结果
Figure 13. Results of nanoindentation test before and after heat treatment. (a) elastic modulus; (b) hardness
表 1 IC10合金的化学成分(质量分数，%)
Table 1 Chemical composition of IC10 alloys
W Al Cr Co Hf Ta C B Ni 4.8～5.2 5.6～6.2 6.5～7.5 11.5～12.5 1.3～1.7 6.5～7.5 ≤ 0.012 ≤ 0.02 余量 
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表 2 SBM-3粉末合金化学成分(质量分数，%)
Table 2 Chemical composition of SBM-3 powder alloy
C Cr Co Mo W Al Ti Nb Ta Re B Ni 0.03～0.1 12.1～12.8 6.8～7.3 0.8～1.2 4.1～4.8 2.8～3.5 4.5～5.0 0.1～0.4 3.2～3.8 2.5～2.7 1.1～1.3 余量
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表 3 母材及80 μm间隙接头热处理前后1 100 ℃/36 MPa持久寿命(h)
Table 3 1 100 ℃/36 MPa creep rupture life for base metal and 80 μm gap joint before and after heat treatment
材料 热处理前 热处理后 IC10母材 117 (未断裂) 102 (未断裂) SBM-3中间层 117 (未断裂) 102 (在试验中出现裂纹)
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位置 C Al Ti Cr Co Ni Mo W Hf Ta 可能相 A 3.87 2.63 1.97 24.9 7.06 19.05 15.52 24.98 — — 富W，Mo，Cr硼化物 B 5.98 1.02 11.7 1.86 2.07 8.33 — — 9.97 59.07 富Hf，Ta，Ti碳化物 C 5.53 2.99 0.99 1.46 2.13 8.01 — — 78.81 — 富Hf碳化物 D 4.68 3.89 2.34 9.60 10.5 68.95 — — — — γ′
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