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钛合金/Cu/不锈钢扩散焊界面化合物生长行为解析

刘树英, 张冬冬, 刘亚洲, 孙艳艳

刘树英, 张冬冬, 刘亚洲, 孙艳艳. 钛合金/Cu/不锈钢扩散焊界面化合物生长行为解析[J]. 焊接学报, 2019, 40(9): 133-138. DOI: 10.12073/j.hjxb.2019400249
引用本文: 刘树英, 张冬冬, 刘亚洲, 孙艳艳. 钛合金/Cu/不锈钢扩散焊界面化合物生长行为解析[J]. 焊接学报, 2019, 40(9): 133-138. DOI: 10.12073/j.hjxb.2019400249
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LIU Shuying, ZHANG Dongdong, LIU Yazhou, SUN Yanyan. Analysis of growth behavior of intermetallic compound in diffusion bonding of Ti alloy/Cu/stainless steel[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(9): 133-138. DOI: 10.12073/j.hjxb.2019400249
Citation: LIU Shuying, ZHANG Dongdong, LIU Yazhou, SUN Yanyan. Analysis of growth behavior of intermetallic compound in diffusion bonding of Ti alloy/Cu/stainless steel[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(9): 133-138. DOI: 10.12073/j.hjxb.2019400249
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钛合金/Cu/不锈钢扩散焊界面化合物生长行为解析

  • 1.

    河南科技大学, 洛阳 471023;有色金属共性技术河南省协同创新中心, 洛阳 471023

  • 2.

    东风精密铸造, 十堰 442000

  • 3.

    河南科技大学, 洛阳 471023

基金项目: 河南科技大学博士科研启动基金资助项目（09001234）

Analysis of growth behavior of intermetallic compound in diffusion bonding of Ti alloy/Cu/stainless steel

  • 1.

    Henan University of Science and Technology, Luoyang 471023, China;Collaborative Innovation Center of Nonferrous Metals, Luoyang 471023, China

  • 2.

    Dongfeng Precision Casting, Shiyan 442000, China

  • 3.

    Henan University of Science and Technology, Luoyang 471023, China

摘要

    摘要
  • 摘要: 采用拉伸、SEM扫描、能谱分析、XRD测试、热–动力学解析等手段，调查、研究了钛合金/Cu/304 扩散焊接头的力学性能、反应相种类、生成顺序及生长厚度. 结果表明，在焊接压力5.0 MPa下，接头的抗拉强度随焊接温度和时间的增加先增高后降低，在焊接温度1 223 K、时间3.6 ks时获得最高接头强度为163 MPa；过分提高温度和时间对接头性能不利. 用铜作中间层，在Cu/304界面侧基本未生成金属间化合物，而在钛合金/Cu界面间形成了由固溶体、金属间化合物TixCuy，TixFey等组成的多层次过渡组织；由钛合金至不锈钢侧界面结构演化依次大致为Ti2Cu，TiCu，TiCu2，TiCu3，TiCu4，Ti2Fe、FeTi，TiFe2金属间化合物；生成的金属间化合物中TixCuy对接头强度的影响略显强于TixFey化合物的趋势；根据推导的经验公式，通过调控温度及时间可以调控金属间化合物的层厚.
    Abstract: The mechanical properties, the generation types, the formation order and the growth thickness of the Ti-6Al-4V/Cu/304 vacuum diffusion welded joint were investigated and studied by means of tensile, SEM scanning, energy spectrum analysis, XRD test and thermo kinetic analysis. The results show that under the bonding pressure of 5 MPa, the tensile strength of the joint increases first and then decreases with the increase of the bonding temperature and time, and the maximum joint is 163 MPa at the bonding temperature of 1 223 K and the time of 3.6 ks, and the excessive temperature and time are unfavorable to the joint performance. With copper foil as the intermediate layer, intermetallic compounds are not formed at the Cu/304 interface. However, a multilevel transitional tissue consisting of solid solution, intermetallic compound TixCuy, TixCuy, ect. is formed between the titanium alloy/Cu interface. The evolution of the structure from titanium to stainless steel side is as follows Ti2Cu, TiCu, TiCu2, TiCu3, TiCu4, Ti2Fe, FeTi, and TiFe2 intermetallic compounds. The order of the generation of the reactant is the lowest priority of the value of the ΔG; The effect of TixCuy on the joints strength of the intermetallic compound is slightly stronger than that of TixCuy compound. The fracture is caused by the fracture of the Ti2Cu intermetallic compound in the zone Ⅱ of the titanium alloy side, which extends into the diffusion layer of intermetallic compounds at the boundary of the zone Ⅱ-Ⅲ and is brittle fracture. Therefore, improving the interface structure from the titanium alloy/Cu side is the main way to improve the joints strength. According to the empirical formula, the layer thickness of the intermetallic compound can be controlled by adjusting the temperature and time.
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    • 参考文献(12)
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  • 收稿日期:  2018-11-09

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