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FCBGA器件SnAgCu焊点的热冲击可靠性分析

姜楠, 张亮, 刘志权, 熊明月, 龙伟民

姜楠, 张亮, 刘志权, 熊明月, 龙伟民. FCBGA器件SnAgCu焊点的热冲击可靠性分析[J]. 焊接学报, 2019, 40(9): 39-42. DOI: 10.12073/j.hjxb.2019400232
引用本文: 姜楠, 张亮, 刘志权, 熊明月, 龙伟民. FCBGA器件SnAgCu焊点的热冲击可靠性分析[J]. 焊接学报, 2019, 40(9): 39-42. DOI: 10.12073/j.hjxb.2019400232
shu
JIANG Nan, ZHANG Liang, LIU Zhiquan, XIONG Mingyue, LONG Weimin. Reliability analysis of thermal shock for SnAgCu solder joints of FCBGA devices[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(9): 39-42. DOI: 10.12073/j.hjxb.2019400232
Citation: JIANG Nan, ZHANG Liang, LIU Zhiquan, XIONG Mingyue, LONG Weimin. Reliability analysis of thermal shock for SnAgCu solder joints of FCBGA devices[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(9): 39-42. DOI: 10.12073/j.hjxb.2019400232
shu

FCBGA器件SnAgCu焊点的热冲击可靠性分析

  • 1.

    江苏师范大学, 徐州 221116

  • 2.

    江苏师范大学, 徐州 221116;中国科学院金属研究所, 沈阳 110016

  • 3.

    中国科学院金属研究所, 沈阳 110016

  • 4.

    郑州机械研究所 新型钎焊材料与技术国家重点实验室, 郑州 450001

基金项目: 国家自然科学基金资助项目（51475220）；中国博士后科学基金资助项目（2016M591464）；江苏省“六大人才高峰”资助项目（XCL-022）；江苏省“青蓝工程”中青年学术带头人计划资助

Reliability analysis of thermal shock for SnAgCu solder joints of FCBGA devices

  • 1.

    Jiangsu Normal University, Xuzhou 221116, China

  • 2.

    Jiangsu Normal University, Xuzhou 221116, China;Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China

  • 3.

    Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China

  • 4.

    State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, China

摘要

    摘要
  • 摘要: 采用有限元法和Garofalo-Arrheninus稳态本构方程，在热冲击条件下对倒装芯片球栅阵列封装（FCBGA）器件SnAgCu焊点的可靠性进行分析. 结果表明，Sn3.9Ag0.6Cu焊点的可靠性相对较高. 通过分析SnAgCu焊点的力学本构行为，发现焊点应力的最大值出现在焊点与芯片接触的阵列拐角处. 随着时间的推移，SnAgCu焊点的应力呈周期性变化. Sn3.9Ag0.6Cu的焊点应力和蠕变最小，Sn3.8Ag0.7Cu焊点应力和蠕变次之，Sn3.0Ag0.5Cu焊点应力和蠕变最大，与实际的FCBGA器件试验结果一致. 基于蠕变应变疲劳寿命预测方程预测三种SnAgCu焊点的疲劳寿命，发现Sn3.9Ag0.6Cu焊点的疲劳寿命比Sn3.0Ag0.5Cu和Sn3.8Ag0.7Cu焊点的疲劳寿命高.
    Abstract: The reliability of SnAgCu solder joint of flip chip ball grid array packaging (FCBGA) device was analyzed by finite element method and Garofalo-Arrheninus steady-state constitutive equation under thermal shock. The results showed that the reliability of Sn3.9Ag0.6Cu solder joints was relatively high. By analyzing the mechanical constitutive behavior of SnAgCu solder joint, the maximum value of solder joint stress was found at the corner of the contact spot between the solder joint and the chip. The stress of SnAgCu solder joint changed periodically over time. The solder joint stress and creep of the solder joint Sn3.9Ag0.6Cu was the smallest, the Sn3.8Ag0.7Cu solder joint second, and the solder joint stress and creep of the Sn3.0Ag0.5Cu solder joint was the largest, which agreed with the actual test results of the FCBGA device. The fatigue life of solder joints was calculated by creep strain fatigue life prediction model. It was found that the fatigue life of Sn3.9Ag0.6Cu solder joint was higher than that of Sn3.0Ag0.5Cu and Sn3.8Ag0.7Cu solder joint.
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    • 参考文献(15)
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  • 收稿日期:  2018-08-22

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