回流温度对单板/板级BGA无铅焊点的剪切力学行为影响
Effect of reflow temperature on the shear behavior of BGA solder joints under veneer structure and board-level structure
-
摘要: 采用试验的方法研究回流温度对Sn3.0Ag0.5Cu，Sn0.3Ag0.7Cu，Sn0.3Ag0.7Cu-0.07La-0.05Ce三种无铅钎料在单板结构/板级结构中剪切性能的影响.结果表明，随着回流温度的升高，单板结构中高银焊点的抗剪强度最高且一直增加，低银焊点呈现出先增加后降低的趋势.板级结构中焊点的抗剪强度均随回流温度的升高呈现出先增加后降低的趋势，其中添加稀土元素的低银焊点的抗剪强度最高.两种结构中焊点的至断位移均随回流温度的升高而降低.板级结构中，随着回流温度的升高，高银焊点的断裂模式由韧性断裂向脆性断裂转变，而低银焊点则一直为韧性断裂，其断裂位置向IMC方向移动.Abstract: The influence of reflow temperature on the shear mechanical properties of three kinds of solders(Sn3.0Ag0.5Cu, Sn0.3Ag0.7Cu and Sn0.3Ag0.7Cu-0.07La-0.05Ce) under veneer structure and board-level structure was studied by shear experiments. Results shown that the shear strength of the high silver solder joints under veneer structure increased with the increase of reflow temperature, while the shear strength of the low silver solder joints under veneer structure increased firstly and then decreased with the increase of reflow temperature. The shear strength of solder joints under board -level structure increased first and then decrease with the increase of reflow temperature, and the shear strength of low silver solder joints with rare earth elements was the highest. The fracture displacement of solder joints under veneer structure and board-level structure decreased with the increase of reflow temperature. The fracture mode of high silver solder joints under board-level structure are changed from ductile fracture to brittle fracture with the increase of reflow temperature. The fracture mode of low silver solder joints under board-level structure always were ductile fractures with the increase of reflow temperature. The fracture position of low silver solder joints under board-level structure shifted to the direction of the IMC with the increase of reflow temperature.
-
Keywords:
- reflow temperature /
- board-level structure /
- shear strengt
-
-
[1] 杜长华,陈方.电子微连接技术与材料[M].北京:机械工业出版社, 2011. [2] Braun T, Becker K F, Koch M, et al. High-temperature reliability of flip chip assemblies[J]. Microelectronics Reliability, 2006, 46(1):144-154. [3] Huang M L, Loeher T, Ostmann A, et al. Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders[J]. Applied Physics Letters, 2005, 86(18):18-19. [4] 李炳旺,吴慧. BGA植球工艺技术[J].电子与封装, 2013, 13(6):24-25 Li Bingwang, Wu Hui. The soldering-ball process technology of BGA[J]. Electronics&Packing, 2013, 13(6):24-25 [5] 贾克明,王丽凤,张世勇,等. BGA单板结构与板级结构焊点剪切力学行为分析[J].焊接学报, 2018, 39(3):94-98 Jia Keming, Wang Lifeng, Zhang Shiyong, et al. Analysis of shear mechanical behavior of solder joints in BGA under veneer structure and board-level structure[J]. Transactions of the China Welding Institution, 2018, 39(3):94-98 [6] Tian Y H, Wang C Q, Zhou W F. Evolution of microstructure of Sn-Ag-Cu lead-free flip chip solder joints during aging process[J]. Acta Metal lurgica Sinica (English Letters), 2006, 19(4):301-306. [7] 杨丽,霍树斌,王辉亭,等.钎焊温度对TC4与Ti-3Al-Nb合金钎焊接头组织的影响[J].焊接学报, 2006, 27(1):105-108 Yang Li, Huo Shubin, Wang Huiting, et al. Influnce of brazing temperature on microstructure of TC4 and Ti-3Al-Nb alloy brazed joint[J]. Transactions of the China Welding Institution, 2006, 27(1):105-108 [8] Kim K S, Hub S H, Suganuma K. Effects of cooling speed on microstructure and tensile properties of Sn-Ag-Cu alloys[J]. Materials Science and Engineering, 2002, 333(1-2):104-114. [9] Iver E Anderson. Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-Free electronic solders application[J]. Mater Sci:Mater Electron, 2007, 18:55-76. [10] 戴文勤,王丽凤,何冰,等. La对Sn-0.3Ag-0.7Cu回流焊点纳米力学性能影响[J].焊接学报, 2015, 36(9):75-78 Dai Wenqin, Wang Lifeng, He Bing, et al. Effect La on nanomechanical properties of Sn-0.3Ag-0.7Cu reflow solder joints[J]. Transactions of the China Welding Institution, 2015, 36(9):75-78 [11] Shi L, Sun F L, Liu Y, et al. Properties analysis of a new type of solder paste SACBN07[J]. China Welding, 2017(2):11-17. [12] Alex C K, Chan Y C. Aging studies of Cu-Sn intermetallic compounds in annealed surface mount solder joints[J]. 1996 Electronic Components and Technology Conference, 1996:1164-1171. [13] 谷柏松,孟工戈,孙凤莲,等. Sn-3.0Ag-0.5Cu/Ni/Cu微焊点剪切强度与断口的研究[J].电子组件与材料, 2013, 32(3):70-76 Gu Bosong, Meng Gongge, Sun Fenglian., et al Research on micro solder joint shear strength and fracture of Sn-3.0Ag-0.5Cu/Ni/Cu[J]. Electronic Components and Materials, 2013, 32(3):70-76 -
期刊类型引用(5)
1. 耿占一，胡连海，霍佳磊，卢立祥，王松涛，陈永福. 激光复合焊技术研究及应用进展. 金属加工(热加工). 2023(04): 1-9 . 
百度学术
2. 侯俊良，周博芳，张红霞，李桃花，满武士，谢昊东. 汽车轻量化铝合金材料的搅拌摩擦焊研究现状. 电焊机. 2023(12): 86-94 . 百度学术
3. 时尚，刘丰刚，黄春平，舒宗富. 激光复合热源焊接技术的研究进展. 材料导报. 2022(11): 170-177 . 百度学术
4. 李桓，徐光霈，张宇辉，吴胜，王飞. 2219/5A06异种铝合金焊接接头组织与性能相关性. 焊接学报. 2020(09): 8-15+97 . 本站查看
5. 邵帅，黄永德，陈玉华. 钛合金搅拌摩擦焊搅拌头研究现状. 精密成形工程. 2019(05): 115-122 . 百度学术
其他类型引用(8)
计量
- 文章访问数: 510
- HTML全文浏览量: 6
- PDF下载量: 63
- 被引次数: 13
下载:
