[1] |
邢继权.高性能无铅铜基轴承合金的制备及其性能研究[D].广州:华南理工大学, 2016.
|
[2] |
吕学勤,杨尚磊,吴毅雄,等.铝合金与不锈钢的过渡层钎焊[J].焊接学报, 2004, 25(1):95-98 Lü Xueqin, Yang Shanglei, Wu Yixiong, et al. Transitional layers brazing of Al-alloy and stainless steel[J]. Transactions of the China Welding Institution, 2004, 25(1):95-98
|
[3] |
Chen H S, Feng K Q, Wei S F, et al. Microstructure and properties of WC-Co/3Cr13 joints brazed using Ni electroplated interlayer[J]. Int. Journal of Refractory Metals and Hard Materials, 2012, 33:70-74.
|
[4] |
黄毅,王春青,赵振清. SnCu钎料合金镀层钎焊连接机理及界面反应[J].金属学报, 2005, 41(8):881-885 Huang Yi, Wang Chunqing, Zhao Zhenqing. Bonding mechanism and interfacial reaction of SnCu filler alloy coating[J]. Acta Metallurgica Sinica, 2005, 41(8):881-885
|
[5] |
马超力,薛松柏,李阳,等.时效对Sn-Cu-Ni-xP-Cu焊点组织与性能的影响[J].焊接学报, 2014, 35(3):85-88 Ma Chaoli, Xue Songbai, Li Yang, et al. Effect of thermal aging on intermetallic compounds and properties of Sn-Cu-Ni-xPr/Cu soldered joints[J]. Transactions of the China Welding Institution, 2014, 35(3):85-88
|
[6] |
王玲玲,孙凤莲,王丽凤,等. SAC0307-xNi/Ni焊点的IMC及镍镀层的消耗[J].焊接学报, 2009, 30(11):53-56 Wang Lingling, Sun Fenglian, Wang Lifeng, et al. IMC of SAC0307-xNi/Ni soldered joint and consumption of Ni coating[J]. Transactions of the China Welding Institution, 2009, 30(11):53-56
|
[7] |
杨思佳,杨晓华. SnAgCu/Cu钎焊接头等温时效下组织性能分析[J].焊接学报, 2013, 33(5):83-86 Yang Sijia, Yang Xiaohua. Microstructure and mechanical properties of SnAgCu/Cu solder joint during isothermal aging[J]. Transactions of the China Welding Institution, 2013, 33(5):83-86
|
[8] |
He P, Zhang J H, Li X Q. Diffusion bonding of titanium alloy to stainless wire mesh[J]. Materials Science and Technology, 2001, 17(9):1158-1162.
|
[9] |
He P, Liu D. Mechanism of forming interfacial intermetallic compounds at interface for solid state diffusion bonding of dissimilar materials[J]. Materials Science and Engineering A, 2006, 437(2):430-435.
|
[10] |
Wang Jianxin, Lai Zhongmin, Wang Yu. Effect of Ce on solderability of Sn-Cu-Ni solder[J]. China Welding, 2011, 20(3):27-31.
|