[1] |
Feynman R P. There's plenty of room at the bottom[J]. Journal of Microelectromechanical Systems, 1992, 1(1):60-66.
|
[2] |
Liu X, Huang X M, Ma H B, et al. Microstructure and properties of the joints of ZrO2 ceramic/stainless steel brazed in vacuum with AgCuTi active filler metal[J]. China Welding, 2018, 27(2):52-56.
|
[3] |
阴旭,刘翠荣,杜超,等.无机填料对高分子固体电解质与金属铝键合性能的影响[J].焊接学报, 2015, 36(11):37-40 Yin Xu, Liu Cuirong, Du Chao, et al. Effect of inorganic fillers on bonding properties of polymer solid electrolyte to metal aluminum[J]. Transactions of the China Welding Institution, 2015, 36(11):37-40
|
[4] |
Liu C, Li J, Chen H, et al. Experiment and simulation analysis of multi-layer glass/aluminum anodic bonding[J]. International Journal of Nonlinear Sciences&Numerical Simulation, 2014, 15(1):69-75.
|
[5] |
Hu L, Xue Y, Shi F. Interfacial investigation and mechanical properties of glass-Al-glass anodic bonding process[J]. Journal of Micromechanics&Microengineering, 2017, 27(10):10.1088/1361-6439/aa83c7.
|
[6] |
Chu H M, Vu H N, Hane K. Electric feed-through for vacuum package using double-side anodic bonding of silicon-on-insulator wafer[J]. Journal of Electrostatics, 2013, 71(2):130-133.
|
[7] |
Despont M, Gross H, Arrouy F, et al. Fabrication of a silicon-Pyrex-silicon stack by a.c. anodic bonding[J]. Sensors&Actuators A Physical, 1996, 55(2-3):219-224.
|
[8] |
Zhang T, Zhang H, Xu J, et al. Study on triple-stack anodic bonding using two electrodes[J]. Sensors&Actuators A Physical, 2010, 157(1):168-172.
|
[9] |
Wallis G. Direct-current polarization during field-assisted glass-metal sealing[J]. Journal of the American Ceramic Society, 1970, 53(10):563-567.
|
[10] |
He J, Yang F, Wang W, et al. Electric current characteristic of anodic bonding[J]. Journal of Micromechanics&Microengineering, 2015, 25(6):65002-65011.
|
[11] |
Knowles K M, Helvoort A T J V. Anodic bonding[J]. Metallurgical Reviews, 2006, 51(5):273-311.
|
[12] |
Xing Q, Sasaki G. Nanostructured gamma-alumina formed during anodic bonding of Al/Glass[J]. Solid State Ionics, 2007, 178(3-4):179-185.
|
[13] |
Howlader M M, Kibria M G, Zhang F, et al. Hybrid plasma bonding for void-free strong bonded interface of silicon/glass at 200 degrees[J]. Talanta, 2010, 82(2):508-515.
|