Sn-9Zn-0.1S/Cu焊点液固界面金属间化合物的生长动力学
Growth kinetics of intermetallic compounds formation between liquid Sn-9Zn-0.1S solders and Cu substrates interface
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摘要: 采用扫描电镜和光学显微镜观察研究了230~260℃焊接温度范围内Sn-9Zn-0.1S/Cu焊点界面金属间化合物的结构及生长动力学.结果表明，在该焊点界面形成的化合物可分为两层：靠铜侧的是厚且平直的γ-Cu5Zn8化合物层；靠焊料侧的则为另一薄且呈扇贝、粒状的CuZn化合物层.提高钎焊温度及延长反应时间基本不改变Sn-9Zn-0.1S/Cu焊点界面金属间化合物的结构和成分，但会使形成的界面金属间化合物层厚度增加.γ-Cu5Zn8金属间化合物层的厚度与反应时间的平方根呈线性关系，表明其生长由扩散机制控制.根据阿伦尼乌斯公式，Sn-9Zn-0.1S/Cu焊点界面γ-Cu5Zn8金属间化合物层反应活化能为22.09 kJ/mol.Abstract: The microstructure and growth kinetics of intermetallic compounds formed during the soldering reactions between Sn-9Zn-0.1S solders and Cu substrates at various temperatures ranging from 230 to 260℃ were investigated using scanning electron microscope and optical microscope. The results indicate that a thick planar layer of γ-Cu5Zn8 next to Cu substrate and a thin particulate layer of CuZn adjacent to solder can be formed at the Sn-9Zn-0.1S/Cu interface, and the constituent of the interfacial intermetallics do not change with the increase of soldering temperature and the prolonged reaction time, while the thickness of γ-Cu5Zn8 layer increases with the soldering temperature and reaction time. The relationship between the thickness of γ-Cu5Zn8 layer and the square root of reaction time fits linear, which shows that the growth of the intermetallic layer is diffusion-controlled. Kinetics analysis indicated that the activation energy of the intermetallic growth was 22.09 kJ/mol.
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Keywords:
- lead free solder /
- Sn-Zn /
- intermetallic compound /
- soldering temperature /
- activation energy
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[1] Mayappan R, Ahmad Z A. Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn-Zn lead-free solder[J]. Intermetallics, 2010, 18:730-735. [2] Lee Y G, Duh J G. Interfacial morphology and concentration profile in the unleaded solder/Cu assembly[J]. Journal of Materials Science:Materials in Electronics, 1999, 10(1):33-43. [3] Wang M C, Yu S P, Chang T C, et al. Kinetics of intermetallic compound formation at 91Sn-8.55Zn-0.45Al lead-free solder alloy/Cu interface[J]. Journal of Alloys and Compounds, 2004, 381:162-167. [4] Huang H Z, Wei X Q, Zhou L. Growth kinetics of intermetallic compounds at the interface of liquid Sn-9Zn/Cu[J]. Advanced Materials Research, 2011, 233− 235:2323− 2327. [5] 薛鹏,王克鸿,周琦,等. Sn-Zn-Nd钎料焊点高温时效界面组织演变[J].焊接学报, 2016, 37(1):33-36 Xue Peng, Wang Kehong, Zhou Qi, et al. Transformation of interfacial microstructure in aged Sn-Zn-Nd solder joint[J]. Transactions of the China Welding Institution, 2016, 37(1):33-36 [6] Wang F J, Huang Y, Tian S, et al. Effect of cooling and aging on microstructure and mechanical properties of Sn-9Zn solder[J]. China Welding, 2017, 26(1):37-43. [7] 帅歌旺,周清泉,黄惠珍. Sn-9Zn/Cu焊点界面金属间化合物层结构研究[J].特种铸造及有色合金, 2016, 36(5):548-551 Shuai Gewang, Zhou Qingquan, Huang Huizhen. Interface structure of Sn-9Zn/Cu lead-free solder joints[J]. Special Casting and Non-ferrous Alloys, 2016, 36(5):548-551 [8] Wei X Q, Li Y H, Huang H Z. Effects of sulfur on the properties of Sn-9Zn as lead-free solder[J]. Journal of Electronic Materials, 2017, 46(2):1067-1071. [9] Sharma R C, Chang Y A. Bulletin of alloy phase diagrams[M]. ASM:Ohio, 1986. [10] Suganuma K, Niihara K, Shoutoku T, et al. Wetting and interface microstructure between Sn-Zn binary alloys and Cu[J]. Journal of Materials Research, 1998, 13(10):2859-2865. [11] Lee C S, Shieu F S. Growth of intermetallic compounds in the Sn-9Zn/Cu joint[J]. Journal of Electronic Materials, 2006, 35(8):1660-1664. [12] Chen W X, Xue S B, Wang H, et al. Reliability studies of Sn-9Zn/Cu and Sn-9Zn-0.3Ag/Cu soldered joints with aging treatment[J]. Journal of Materials Science:Materials in Electronics, 2010, 21:779-786. [13] Suganuma K. Advances in lead-free electronics soldering[J]. Current Opinion in Solid State Materials Science, 2001, 5:55-64. [14] Yu S P, Hon M H, Wang M C. The adhesion strength of a lead-free solder hot-dipped on copper substrate[J]. Journal of Electronic Materials, 2000, 29(2):237-243. [15] Kim D G, Jang H S, Jung S B. Kinetics of intermetallic layer growth and interfacial reactions between Sn-8Zn-5In solder and bare copper substrate[J]. Materials Science&Technology, 2013, 21(3):381-386. [16] Lin W H, Chuang T H. Interfacial reactions between liquid Sn-8Zn-3Bi solders and Cu substrates[J]. Journal of Materials Engineering and Performance, 2003, 12(4):452-455. -
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