Abstract: Ag-Cu filler was used to braze ZTA ceramic and TC4 alloy. Scanning electron microscopy, energy disperse spectroscopy and X ray diffraction were used to identify the interfacial microstructure and the reaction mechanism of the joints was clarified. The typical interfacial microstructure was ZTA ceramic/TiO+Ti₃(Cu,Al)₃O/Ag(s,s)/Ti₂Cu₃/TiCu/Ti₂Cu/α+β-Ti/TC4 alloy. The experiments were carried at the brazing temperature from 810 °C to 910 °C. The results indicated that as the brazing temperature increased, Ag-based solid solution layer thinned and Ti-Cu intermetallic compound layers thickened. When brazed at 890 °C for 10 min, Ti-Cu intermetallic compounds occupied almost the entire brazing area, and the shear strength of the joints reached the highest value of 43.2 MPa.