Optimization and research of BGA solder joint about signal integrity facing complete transmission path
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摘要: 建立了基于BGA(ball grid array)焊点的完整传输路径的HFSS(high frequency simulator structure)电磁仿真模型，基于该模型对完整传输路径在高频条件下的信号完整性问题进行了分析，得到了其回波损耗仿真结果，以及焊点最大径向尺寸、焊点高度尺寸、焊盘直径尺寸对回波损耗的影响. 并以焊点最大径向尺寸、焊点高度尺寸、焊盘直径尺寸为设计参数，以完整传输路径6 GHz下的回波损耗作为目标值，设计17组试验仿真计算，采用响应曲面法对仿真计算所得的17组完整传输路径回波损耗与BGA焊点形态参数间关系进行拟合，结合遗传算法对拟合函数进行优化，得到完整传输路径回波损耗最小的BGA焊点组合参数为焊点最大径向尺寸1.05 mm，焊点高度0.75 mm，焊盘直径0.65 mm，并对最优组合参数仿真验证，最优组合仿真结果优于17组试验仿真结果，实现了完整传输路径中BGA焊点的结构优化.Abstract: The simulation model of complete transmission path based on BGA solder joint was built by HFSS software, the return loss of complete transmission path were obtained based on the model. The impacts of signal frequency, solder joint maximum radial size, pad diameter and solder joint height on return loss were also studied. Taking the maximum size of the solder joint, solder joint height, the diameter of pad size as design parameters, the return loss as the target value, design and calculation of 17 sets of experiments using computational simulation. 17 sets of simulation of complete transmission path loss and the relationship between the parameters of BGA solder joint shape fitting by the response surface method, combined with genetic algorithm for fitting function optimization. BGA solder joint parameters with minimum return loss in full transmission path is the maximum size of 1.05 mm solder joint, height of solder joint is 0.75 mm, the diameter of pad is 0.65 mm, and the optimal combination of parameters of the simulation, the optimal combination of simulation results. The result of optimal combination is better than 17 sets of experimental results, and the optimization of the solder joint structure in the whole transmission path is realized.
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Keywords:
- BGA solder joint /
- complete transmission path /
- return loss /
- response surface /
- genetic algorithm
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