Effect of In element on spreadability and micro-interface of Zn15Al5Cu solder
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摘要: 为获得性能良好的铜铝钎焊用钎料，以Zn15Al5Cu钎料为基体，添加不同质量的In元素，制得Zn15Al5CuxIn(x = 0,1,3,5,x为质量分数)钎料；通过扫描电子显微镜(SEM)、能谱仪(EDS)等分析测试手段，研究了Zn15Al5CuxIn钎料在铝板和铜板上的铺展性以及界面成分变化规律. 结果表明，添加适量的 In元素，可以明显改善Zn15Al5Cu钎料在铜铝两种板上的润湿性；随着In元素添加量的增加，Zn15Al5CuxIn元素钎料在铝板上铺展面积逐渐增大，当 In元素添加量为5%时，Zn15Al5Cu5In 钎料在铝板上铺展面积最大，为251 mm2，较基体钎料提高42.6%；随着In元素添加量增加，Zn15Al5CuxIn元素钎料合金在铜板上铺展面积先增大后降低，当In元素添加量为3%时，Zn15Al5Cu3In钎料在铜板上铺展面积最大，为110 mm2，较基体钎料提高了69%.Abstract: In order to obtain brazing material for copper and aluminum brazing with good performance, Zn15Al5CuxIn (x = 0,1,3,5) brazing material is prepared by adding different quality In. Through scanning electron microscope (SEM), energy disperse spectroscopy (EDS) and other analytical testing methods, the spreadability of Zn15Al5CuxIn solder on Al, Cu plates and the change of interface composition were studied. The results show that the addition of an appropriate amount of In can significantly improve the wettability of Zn15Al5Cu solder on Cu and Al base metals. When the amount of In added is 5%, the Zn15Al5Cu5In solder has the largest spread area on the Al base material, reaching 251 mm2, which is 42.6% higher than that of the base solder; When the In addition amount is 3%, the Zn15Al5Cu3In solder has the largest spread area on the Cu base material, reaching 110 mm2, which is 69% higher than the base solder.
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图 1 Zn15Al5CuxIn钎料合金在铝板上铺展面积
Figure 1. Spreading area of Zn15Al5CuxIn solder alloys on Al plate
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图 2 Zn15Al5CuxIn/Al微观界面
Figure 2. Microstructure interface of Zn15Al5CuxIn/Al.(a) Zn15Al5Cu；(b) Zn15Al5Cu1In；(c) Zn15Al5Cu3In；(d) Zn15Al5Cu5In
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图 3 Zn15Al5CuxIn钎料在铜板上铺展面积
Figure 3. Spreading area of Zn15Al5CuxIn solder alloys on Cu plate
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图 4 Zn15Al5CuxIn/Cu微观界面
Figure 4. Microstructure interface of Zn15Al5CuxIn/Cu. (a) Zn15Al5Cu；(b) Zn15Al5Cu1In；(c) Zn15Al5Cu3In；(d) Zn15Al5Cu5In
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