Abstract: Effects of 0.5% CuZnAl memory particles on the microstructures and properties of brass/Sn/brass solder joints were investigated based on TLP bonding with 0.2 N and 50 N pressures. With the addition of 0.5% CuZnAl memory particles, the interfacial reaction could be inhibited, which was attributed to the decrease of elemental diffusion at the interface. Moreover, comparing to 0.2 N pressure, the large amount of voids could be found under 50 N pressure because of strong elemental diffusion. No defects were observed in solder joints at the 0.2 N pressure, and the uniform microstructures were found at the interface. The shear force was enhanced by 20~25%. In addition, the microstructures of the brass/Sn-CuZnAl/brass solder joints could be changed into intermetallic compounds completely under the expermental parameters (0.2 N pressure, 250 °C (10 min), 200 °C (1 100 h)), and no voids were observed.