CuZnAl记忆颗粒对黄铜/锡/黄铜焊点组织与性能影响

张亮,刘志权,郭永环,杨帆,钟素娟

doi:10.12073/j.hjxb.2018390297

CuZnAl记忆颗粒对黄铜/锡/黄铜焊点组织与性能影响

张亮,刘志权,郭永环,杨帆,钟素娟

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- 收稿日期: 2017-06-08

Effects of CuZnAl memory particles on the microstructures and properties of brass/Sn/brass solder joints

ZHANG Liang, LIU Zhiquan, GUO Yonghuan, YANG Fan, ZHONG Sujuan

摘要

摘要: 研究了不同压力条件下(0.2 N，50 N)瞬时液相键合0.5%亚微米CuZnAl记忆颗粒对黄铜/锡/黄铜焊点组织和性能影响. 发现0.5%亚微米CuZnAl记忆颗粒对界面组织有一定的抑制作用，主要归因于亚微米颗粒的存在减小了元素之间的扩散速率. 另外相对0.2 N压力条件下，50 N压力下由于元素剧烈扩散易于使界面出现大量的空洞，而0.2 N压力界面组织则较为均匀，并且未出现明显的空洞. 力学性能结果表明，添加0.5%亚微米CuZnAl记忆颗粒，焊点的剪切力提高20%~25%. 在0.2 N压力、250 ℃保温10 min，随后200 ℃保温1 100 h可以将黄铜/锡-CuZnAl/黄铜焊点完全转化为金属间化合物，并未发现明显的空洞.
- 键合瞬时液相|剪切力|压力|金属间化合物
Abstract: Effects of 0.5% CuZnAl memory particles on the microstructures and properties of brass/Sn/brass solder joints were investigated based on TLP bonding with 0.2 N and 50 N pressures. With the addition of 0.5% CuZnAl memory particles, the interfacial reaction could be inhibited, which was attributed to the decrease of elemental diffusion at the interface. Moreover, comparing to 0.2 N pressure, the large amount of voids could be found under 50 N pressure because of strong elemental diffusion. No defects were observed in solder joints at the 0.2 N pressure, and the uniform microstructures were found at the interface. The shear force was enhanced by 20~25%. In addition, the microstructures of the brass/Sn-CuZnAl/brass solder joints could be changed into intermetallic compounds completely under the expermental parameters (0.2 N pressure, 250 °C (10 min), 200 °C (1 100 h)), and no voids were observed.
- TLP bonding|shear force|pressures|intermetallic compounds

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CuZnAl记忆颗粒对黄铜/锡/黄铜焊点组织与性能影响

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Effects of CuZnAl memory particles on the microstructures and properties of brass/Sn/brass solder joints

期刊类型引用(8)

其他类型引用(8)

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