超低银SAC钎料焊点界面显微组织演化
Microstructures evolution of low silver SnAgCu solder joint
-
摘要: 研究了复合添加Ga/Nd元素的超低银Sn-0.3Ag-0.7Cu钎料在长期时效过程中的微焊点界面组织演化情况. 结果表明，复合添加适量Ga/Nd元素可以显著改善时效后微焊点界面组织，抑制微焊点界面附近大块状金属间化合物以及稀土相的生成. 经720 h时效后，即使在含有过量Nd元素的微焊点界面仍没有发现明显的Ag3Sn相和稀土相，取而代之的是小块状的新相，结合EDS和XRD分析结果推测该相含有Ga2Nd与Cu6Sn5. 经过长期时效处理后，微焊点抗剪力接近Sn-3.8Ag-0.7Cu焊点抗剪力的90%，具有较好的力学性能.Abstract: The effect of Ga/Nd multi-addition on microstructure of Sn–0.3Ag–0.7Cu solder in the course of aging treatment was investigated. The results indicated that the multi-addition of Ga/Nd could significantly refine the interfacial microstructure of solder joint and inhibit the formation of intermetallic compounds after aging treatment. After aging treatment over 720 h, no evident rare earth phase Ag3Sn was found in Sn–0.3Ag–0.7Cu–0.5Ga–1Nd solder joints, instead, new phase was formed near the interface of solder joint And the results of EDS and XRD indicated that the new phase should contain Ga2Nd and Cu6Sn5. The shear force of Sn–0.3Ag–0.7Cu solder joint after aging treatment reached 90% of Sn–3.8Ag–0.7Cu solder joint.
-
-
[1] Xu S, Habib A H, Pickel A D, et al. Magnetic nanoparticle-based solder composites for electronic packaging applications[J]. Progress in Materials Science, 2015, 67: 95 ? 160. [2] 刘 平, 顾小龙, 赵新兵, 等. 不同Ag元素含量Sn-Ag-Cu无铅钎料性能分析[J]. 焊接学报, 2012, 33(6): 55 ? 58
Liu Ping, Gu Xiaolong, Zhao Xinbing, et al. Properties of Sn-Ag-Cu lead free solders with different silver content[J]. Transactions of the China Welding Institution, 2012, 33(6): 55 ? 58[3] Tang Y, Luo S M, Li G Y, et al. Effect of Mn nanoparticles on interfacial intermetallic compound growth in low-Ag Sn-0.3Ag-0.7Cu-x Mn solder joints[J]. Journal of Electronic Materials, 2017, 47(2): 1673 ? 1685. [4] Wu J, Xue S, Wang J, et al. Effect of Pr addition on properties and Sn whisker growth of Sn-0.3Ag-0.7Cu low-Ag solder for electronic packaging[J]. Journal of Materials Science Materials in Electronics,, 2017, 28(14): 10230 ? 10244. [5] ?imeková Beáta, Erika H, Ingrid K. Development of SnAgCu solders with Bi and In additions and microstructural characterization of joint interface[J]. Welding in the World, 2017, 61(3): 1 ? 9. [6] Association Connecting Electronics Industries. Guidelines for accelerated reliability testing of surface mount solder attachments: IPC-SM-785 [S]. Illinois, 1992. [7] Department of Defense of the USA. Test method military standard for microelectronics: MIL-STD-883 [S]. Columbus: AMSC N/A, 1990. [8] Council of Japan Industry Standard. Test methods for lead-free solders—Part7: methods for shear strength of solder joints on chip components: JIS Z 3198-2[S]. Japan, 2003. [9] 皋利利, 薛松柏, 许 辉. SnAgCu-xPr钎料组织及性能[J]. 焊接学报, 2012, 33(1): 69 ? 72
Gao Lili, Xue Songbai, Xu Hui. Microstructure and properties of SnAgCu-xPr solder[J]. Transactions of the China Welding Institution, 2012, 33(1): 69 ? 72[10] El-Daly A A, El-Taher A M, Gouda S. Development of new multicomponent Sn-Ag-Cu-Bi lead-free solders for low-cost commercial electronic assembly[J]. Journal of Alloys & Compounds, 2015, 627: 268 ? 275. [11] Zhang Q Y, Liu S Q, Liu D Q, et al. Effect of trace additives on anti-oxidation of molten Sn-Pb eutectics[J]. Acta Metallurgica Sinica, 1984, 20(4): A296 ? A302. [12] Xue P, Xue S B, Shen Y F, et al. Inhibiting the growth of Sn whisker in Sn-9Zn lead-free solder by Nd and Ga[J]. Journal of Materials Science Materials in Electronics, 2014, 25(6): 2671 ? 2675. -
期刊类型引用(14)
1. 陈玉龙，别渭毅，鲁军，杨盼盼，张力. 超薄板脉冲激光焊接工艺特性及成形质量控制. 航天制造技术. 2024(01): 38-42 . 
百度学术
2. 张鑫源，孙振邦. 能量配比对铝合金激光-MIG复合焊接残余应力的影响. 焊接. 2024(06): 47-53 . 百度学术
3. 赵轩. 激光加工在电梯钣金件制造领域中的应用. 中国电梯. 2024(11): 70-73 . 百度学术
4. 张景祺，相志磊，王细波，雷永平，林健. 超薄板焊后波浪变形的形成原因及控制方法探讨. 机械工程学报. 2022(04): 72-79 . 百度学术
5. 陆国强，赵航，吴馥云. 基于激光光栅载波技术的微位移测量方法. 激光杂志. 2022(04): 65-69 . 百度学术
6. 张曌，李嘉宁. 激光精密加工成型技术及产业化应用. 中国铸造装备与技术. 2022(03): 16-22 . 百度学术
7. 何建萍，吴鑫，吉永丰，卢飞. 100 μm超薄不锈钢板脉冲微束等离子弧焊成形机理. 焊接学报. 2021(06): 77-84+101-102 . 本站查看
8. 黄波，王旺，王佳，李轩，何庆中，左超. 全焊接球阀焊接残余应力及变形数值模拟. 油气储运. 2021(08): 895-902 . 百度学术
9. 王钰，王凯，罗子艺，卢清华，杨景卫. 大功率激光焊接工艺对304不锈钢焊接接头组织和电化学行为的影响. 焊接. 2020(03): 17-23+65-66 . 百度学术
10. 钱伟，蒋明. 数字图像相关方法中数字散斑场的制作与应用研究. 液晶与显示. 2020(08): 861-869 . 百度学术
11. 火巧英，闫海宁，涂本荣，陆安进. 焊接工艺参数对Q345NQR2耐候钢激光焊焊缝成形的影响. 焊接技术. 2020(08): 16-18+105-106 . 百度学术
12. 王旺，王佳，曹修全，何庆中，刘惺. Q235钢等离子熔覆的残余应力及变形数值模拟. 特种铸造及有色合金. 2020(09): 975-979 . 百度学术
13. 吴承隆，尹浩，黄泽涵. GH4169镍基高温合金脉冲激光焊工艺参数优化. 工具技术. 2020(10): 38-42 . 百度学术
14. 朱国仁，庞立林，朱慨迅，杨明，王洪潇. 预拉伸对不锈钢电阻点焊接头疲劳寿命的影响. 焊接. 2020(11): 1-4+61 . 百度学术
其他类型引用(15)
计量
- 文章访问数: 492
- HTML全文浏览量: 10
- PDF下载量: 2
- 被引次数: 29
下载:
