埋入式基板微尺度球栅阵列焊点三点弯曲应力应变分析
Stress and strain analysis of embedded substrate micro-scale ball grid array solder joint under three point bending
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摘要: 建立了埋入式基板微尺度球栅阵列焊点三点弯曲应力应变有限元分析模型，分析了焊点材料、焊点间距、PCB支撑跨度及焊点阵列对焊点弯曲应力应变的影响，结果表明，三点弯曲加载条件下，埋入式基板微尺度BGA焊点阵列的最大弯曲应力应变均出现在最外围拐角处焊点上.当三点弯曲加载到相同位移载荷下，SAC387材料焊点的弯曲应力最大，62Sn36Pb2Ag材料焊点的弯曲应力最小；随着支撑跨度的增大，焊点内最大弯曲应力应变均随之减小；随着BGA焊点间距的增大，焊点内部最大弯曲应力应变值均增大；随着BGA焊点阵列数的增大，焊点内部最大应力应变值均增大.Abstract: The three point bending stress and strain finite element analysis model of embedded substrate micro scale grid electrode array welding spot is established. The influence of solder joint material, spot distance, PCB support span and solder joint array on the bending stress and strain of solder joints is analyzed. The results show that the maximum BGA solder joint of embedded substrate is maximum under the condition of three point bending loading. Bending stress and strain all appear on the solder joints at the most peripheral corner. When the three point bending load is loaded to the same displacement load:the bending stress of the solder joint of the SAC387 material is the largest, the bending stress of the solder joint of the 62Sn36Pb2Ag material is the smallest, and the maximum bending stress and strain in the solder joints decrease with the increase of the span of the support, and the maximum bending stress and strain inside the solder joints increase with the increase of the distance between the BGA solder joints. With the increase of the number of BGA solder joints, the maximum stress and strain values of solder joints increase.
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