BGA单板结构与板级结构焊点剪切力学行为分析

贾克明,王丽凤,张世勇,刘海涛

doi:10.12073/j.hjxb.2018390076

BGA单板结构与板级结构焊点剪切力学行为分析

贾克明,王丽凤,张世勇,刘海涛

计量
- 文章访问数: 532
- HTML全文浏览量: 2
- PDF下载量: 0
出版历程
- 收稿日期: 2016-08-08

Analysis of shear mechanical behavior of solder joints in BGA in veneer structure and board-level structure

JIA Keming, WANG Lifeng, ZHANG Shiyong, LIU Haitao

摘要

摘要: 采用试验方法研究BGA封装结构中焊点的剪切力学行为. 分析并比较了Sn-3Ag-0.5Cu,Sn-0.3Ag-0.7Cu,Sn-0.3Ag-0.7Cu-0.07La和Sn-0.3Ag-0.7Cu-0.07La-0.05Ce四种钎料焊点在单板结构与板级结构中的力学性能. 结果表明, 单板结构中焊点的抗剪强度高于板级结构中焊点的抗剪强度. 在单板结构中，高银焊点的抗剪强度最大，加入稀土元素的低银焊点只是得到了一定程度上的改善，然而对于板级结构，加入稀土元素的低银焊点剪切力学性能基本与高银焊点相当. 在同等拘束条件下，低银焊点的延展性优于高银焊点. 此外，对于同一种钎料而言，单板结构中的焊点断裂在体钎料上，而板级结构则断裂在IMC/体钎料界面处.
- BGA /
- 剪切性能 /
- 单板结构 /
- 板级结构
Abstract: The shear behavior of solder joints in BGA package structure is studied by shear experiments. The mechanical properties of four solder joints with Sn-3Ag-0.5Cu, Sn-0.3Ag-0.7Cu, Sn-0.3Ag-0.7Cu-0.07La and Sn-0.3Ag-0.7Cu-0.07La-0.05Ce in the veneer and board-level structure were compared and analyzed. The results show that the shear strength of the solder joints in veneer structure is higher than that of the solder joints in board-level structure. The shear strength of the high-silver solder joints is the largest and the low-silver solder joint with rare earth element has been improved to a certain extent in veneer structure. However, the shear mechanical properties of low-silver solder joints with rare earth elements are basically equivalent to those of high-silver solder joints in board-level structure. The ductility of the low-silver solder joints is better than that of the high-silver solder joints under the same constraint conditions. In addition, for the same solder, the joints in veneer structure fracture in the bulk solder, and the joints in board-level structure fracture at the interface of the IMC and bulk solder.
- BGA /
- shear properties /
- veneer structure /
- board-level structure

HTML全文

参考文献(1)

[1]

高瑞婷, 李晓延, 朱永鑫, 等. 加载速率和钎料厚度对SnAgCu/Cu焊点剪切行为影响[J]. 焊接学报, 2016, 37(2): 94-98.Gao Ruiting, Li Xiaoyan, Zhu Yongxin,et al. Effect of loading rates and solder thickness on shear behav-ior of SnAgCu/Cu lead-free solder joint[J]. Transactions of the China Welding Institution, 2016, 37(2): 94-98.[2] Reza J M, Jung S B. Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging[J]. Microelectronic Reliability, 2007, 47(12): 2169-2178.[3] 李勋平. BGA结构Cu(Ni)/Sn-3.0Ag-0.5Cu/Ni(Cu)微焊点显微组织形成和演化及剪切断裂行为的尺寸效应[D]. 广州: 华南理工大学, 2011.[4] Moy W H, Shen Y L. On the failure path in shear-tested solder joints[J]. Microelectronics Reliability, 2007, 47(8): 1300-1305.[5] Zhao J, Cheng C Q, Qi L,et al. Kinetics of intermetallic compound layers and shear strength in Bi-bearing SnAgCu/Cu soldering couples[J]. Journal of Alloys and Compounds, 2009, 473(1-2): 382-388.[6] 戴文勤, 王丽凤, 何冰, 等. La对Sn-0.3Ag-0.7Cu回流焊点纳米力学性能影响[J]. 焊接学报, 2015, 36(9): 75-78.Dai Wenqin, Wang Lifeng, He Bing,et al. Effect of La on nano mechanical properties of Sn-0.3Ag-0.7Cu reflow solder joints[J]. Transactions of the China Welding Institution, 2015, 36(9): 75-78.[7] Shi Y W, Tian J, Hao H,et al. Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder[J]. Journal of Alloys and Compounds, 2008, 453(2): 180-181.[8] Benlih H, Hong S H, Ning C L. A compliant and creep resistant SAC-Al(Ni) alloy[C]∥Proceedings 57th Electronic Components and Technology Conference. Reno, Nevada, USA, 2007: 184-191.[9] 谷柏松, 孟工戈, 孙凤莲, 等. Sn-3.0Ag-0.5Cu/Ni/Cu微焊点剪切强度与断口的研究[J]. 电子元件与材料, 2013, 32(3): 70-76.Gu Baisong, Meng Gongge, Sun Fenglian,et al. Study on shear strength and fracture surface of Sn-3.0Ag-0.5Cu/Ni/Cu micro solder joints[J]. Electronic Components and Materials, 2013, 32(3): 70-76.

施引文献(1)

期刊类型引用(0)

其他类型引用(1)

资源附件(0)

计量

文章访问数: 532
HTML全文浏览量: 2
PDF下载量: 0
被引次数: 1

BGA单板结构与板级结构焊点剪切力学行为分析

计量

出版历程

Analysis of shear mechanical behavior of solder joints in BGA in veneer structure and board-level structure

期刊类型引用(0)

其他类型引用(1)

计量

出版历程

目录