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基于广义铺展条件下的倒装焊焊点形态预测

王晨曦,王源,田艳红,王春青

王晨曦,王源,田艳红,王春青. 基于广义铺展条件下的倒装焊焊点形态预测[J]. 焊接学报, 2018, 39(2): 1-4,14. DOI: 10.12073/j.hjxb.2018390029
引用本文: 王晨曦,王源,田艳红,王春青. 基于广义铺展条件下的倒装焊焊点形态预测[J]. 焊接学报, 2018, 39(2): 1-4,14. DOI: 10.12073/j.hjxb.2018390029

基于广义铺展条件下的倒装焊焊点形态预测

  • 摘要: 随着电子元器引线密度的不断提高,不同条件下焊点形态的精确预测至关重要. 考虑钎料量过大溢出到焊盘以外区域(如焊盘外侧的阻焊层或基板)的情况,基于所提出的广义铺展条件建立了适用于倒装焊焊点的三维形态预测模型,给出了基于该模型的能量及体积约束方程. 此外,给出了钎料在不润湿表面接触角的测量方法,通过该方法得到了钎料与基板间的润湿角参数,在此基础上利用Surface Evolver有限元软件对倒装焊焊点形态进行了预测并进行了试验验证. 结果表明,在各种条件下模拟与试验结果吻合良好.
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  • 收稿日期:  2017-07-23

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