Abstract: In order to control the residual stress in the process of laser deposition repair and reduce the deformation of the substrate, a laser deposition parts thermal coupling field numerical simulation in the repair surface was established on the ANSYS parametric design programming language. Thermal cycle characteristics, distribution rule of temperature field and residual stress field was analyzed under sequential scan and subarea scan. The results showed that the thermal cycle of nodes was similar under different scanning patterns. And substrate heat accumulation decreased greatly by subarea scan, at the same time the temperature distribution is relatively uniform so as to improve the stress concentration in the substrate and reduce residual stress. In order to verify the result, laser deposition temperature field and residual stress were measured by infrared thermometer and indentation strain gauge, and the substrate material deformation curve was plotted. The results showed that numerical simulations was in good agreement with the experimental results.