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石墨烯纳米片对Sn-58Bi钎料显微组织和性能的影响

邱希亮, 郝成丽, 修子扬, 何鹏

邱希亮, 郝成丽, 修子扬, 何鹏. 石墨烯纳米片对Sn-58Bi钎料显微组织和性能的影响[J]. 焊接学报, 2017, 38(4): 63-66,71. DOI: 10.12073/j.hjxb.20170415
引用本文: 邱希亮, 郝成丽, 修子扬, 何鹏. 石墨烯纳米片对Sn-58Bi钎料显微组织和性能的影响[J]. 焊接学报, 2017, 38(4): 63-66,71. DOI: 10.12073/j.hjxb.20170415
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QIU Xiliang, HAO Chengli, XIU Ziyang, HE Peng. Effect of graphene nanoplates on microstructure and properties of Sn-58Bi solders[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(4): 63-66,71. DOI: 10.12073/j.hjxb.20170415
Citation: QIU Xiliang, HAO Chengli, XIU Ziyang, HE Peng. Effect of graphene nanoplates on microstructure and properties of Sn-58Bi solders[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(4): 63-66,71. DOI: 10.12073/j.hjxb.20170415
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石墨烯纳米片对Sn-58Bi钎料显微组织和性能的影响

  • 1.

    哈尔滨工业大学 焊接与连接国家重点实验室, 哈尔滨 150001

  • 2.

    北京华航无线电测量研究所, 北京 100013

基金项目: 先进焊接与连接国家重点实验室资助项目（AWJ-16-M08）；新型钎焊材料与技术国家重点实验室资助项目（SKLABFMT-2015-01）

Effect of graphene nanoplates on microstructure and properties of Sn-58Bi solders

  • 1.

    State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China

  • 2.

    Beijing Huahang Radio Measurement & Research Institute, Beijing 100013, China

摘要

    摘要
  • 摘要: 文中通过粉末冶金法在Sn-58Bi钎料中添加不同质量分数的石墨烯纳米片（GNSs），以分析GNSs含量对Sn-58Bi钎料显微组织和性能的影响.结果表明，添加GNSs，对Sn-58Bi钎料熔点无明显影响；随着GNSs添加量提高，Sn-58Bi钎料的密度和显微维氏硬度先升高后降低；通过对比添加质量分数为0.05%的GNSs前后Sn-58Bi钎料/铜基板钎焊接头抗剪强度发现，添加GNSs后，由于能够起到细晶强化和弥散强化两方面作用，从而使钎焊接头抗剪切断裂能力提高.
    Abstract: In the present work, Sn-58Bi composite solders with different amount of graphene nanoplates (GNSs) have been prepared by powder metallurgy method. The melting point of the solder was slightly affected by the addition of few amount of GNSs. With the increase of the amount of GNPs, the density and vickers microhardness were firstly increased to the peak value and then decreased with further addition of GNSs. It has been found that the brazed joint of Sn-58Bi/Cu substrate could be significantly improved by the addition of GNSs. The improvement should be attributed to the grain refinement and the dispersion strengthening effect of GNSs.
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    • 参考文献(8)
  • [1] 赵玉琳. 铅污染对儿童健康的影响综述[J]. 安徽预防医学杂志, 2005, 8(3): 163-166. Zhao Yulin. Areview of lead pollution on children's health[J]. Journal of Anhui Preventive Medicine, 2005, 8(3): 163-166.
    [2] Yang L, Dai J, Zhang Y, et al. Influence of BaTiO3 nanoparticle addition on microstructure and mechanical properties of Sn-58Bi solder[J]. Journal of Electronic Materials, 2015, 44(7): 2473-2478.
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    [4] 夏志东, 雷永平, 史耀武. 绿色高性能无铅钎料的研究与发展[J]. 电子工艺技术, 2002, 23(5): 185-191. Xia Zhidong, Lei Yongping, Shi Yaowu.Research and development of green high performance lead-free solder[J]. Electronic Process Technology, 2002, 23(5): 185-191.
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    [6] 黄亦龙. 石墨烯+Sn-Ag-Cu复合钎料性能研究[D]. 哈尔滨: 哈尔滨工业大学, 2015.
    [7] 陈国华. 石墨烯微片的制备及其产业化相关问题[C]//2010年全国高分子材料科学与工程研讨会学术论文集(上册). 南昌: 江西人民出版社, 2010: 327-328.
    [8] 刘晓英. Sn基复合无铅钎料的研究[D]. 大连: 大连理工大学, 2010.
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  • 收稿日期:  2016-10-08

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