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电迁移诱发镀层锡须生长行为分析

姚宗湘, 罗键, 尹立孟, 蒋德平, 王刚, 陈志刚

姚宗湘, 罗键, 尹立孟, 蒋德平, 王刚, 陈志刚. 电迁移诱发镀层锡须生长行为分析[J]. 焊接学报, 2017, 38(4): 35-38. DOI: 10.12073/j.hjxb.20170408
引用本文: 姚宗湘, 罗键, 尹立孟, 蒋德平, 王刚, 陈志刚. 电迁移诱发镀层锡须生长行为分析[J]. 焊接学报, 2017, 38(4): 35-38. DOI: 10.12073/j.hjxb.20170408
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YAO Zongxiang, LUO Jian, YIN Limeng, JIANG Deping, WANG Gang, CHEN Zhigang. Electromigration induced growth behaviors of tin whisker on tin coating[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(4): 35-38. DOI: 10.12073/j.hjxb.20170408
Citation: YAO Zongxiang, LUO Jian, YIN Limeng, JIANG Deping, WANG Gang, CHEN Zhigang. Electromigration induced growth behaviors of tin whisker on tin coating[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(4): 35-38. DOI: 10.12073/j.hjxb.20170408
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电迁移诱发镀层锡须生长行为分析

  • 1.

    重庆大学 机械传动国家重点实验室, 重庆 400030;重庆科技学院 冶金与材料工程学院, 重庆 401331

  • 2.

    重庆大学 机械传动国家重点实验室, 重庆 400030

  • 3.

    重庆科技学院 冶金与材料工程学院, 重庆 401331;哈尔滨工业大学 先进焊接与连接国家重点实验室, 哈尔滨 150001

  • 4.

    重庆科技学院 冶金与材料工程学院, 重庆 401331

基金项目: 国家自然科学基金资助项目（51674056）；重庆市前沿与应用基础研究资助项目（cstc2014jcyjA40009）；先进焊接与连接国家重点实验室开放课题研究基金资助项目（AWJ-M15-05）；重庆市高校创新团队建设计划资助项目（CXTDX201601032）

Electromigration induced growth behaviors of tin whisker on tin coating

  • 1.

    The State Key Laboratory of Mechanical Transmission, Chongqing University, Chongqing 400030, China;School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology, Chongqing 401331, China

  • 2.

    The State Key Laboratory of Mechanical Transmission, Chongqing University, Chongqing 400030, China

  • 3.

    School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology, Chongqing 401331, China;State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China

  • 4.

    School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology, Chongqing 401331, China

摘要

    摘要
  • 摘要: 分析了0.3×104 A/cm2恒定电流密度和四种不同加载时间（0，48，144和240 h）电迁移条件对6.5 μm厚镀锡层表面锡须生长行为的影响，以及不同电流密度对阴极裂纹宽度的影响.结果表明，电迁移加速了镀层表面锡须的形成与生长，随着电迁移时间的延长，锡须长度不断增加.此外，电迁移导致在阴极首先出现了圆形空洞，随后在两极均形成了圆形空洞，并且在阴极处还发现有微裂纹存在，随着电流密度增加，阴极裂纹宽度也随之增加，电流密度为0.5×104 A/cm2时，平均最大裂纹宽度约为9.2 μm.
    Abstract: In this paper, the effect of electromigration on growth behaviors of tin whisker on the tin coating with a thickness of 6.5 μm was investigated, the current density was 0.3×104 A/cm2, and electromigration loading time was 0 h, 48 h, 144 h and 240 h respectively. The results show that electromigration accelerate the tin whisker formation and growth on the electroplated tin coating, and the length of the tin whiskers increases with the increasing of electromigration time. In addition, voids occur firstly at the cathode after current loading. With longer loading time, voids are observed at both anode and cathode, and cracks are also found at the cathode. The length of tin whiskers increases with the increasing of current density. The average maximum crack width is close to 9.2 μm with the current density of 0.5×104 A/cm2.
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    [4] 尹立孟, 张新平. 电子封装微互连中的电迁移[J]. 电子学报, 2008, 36(8): 1610-1614. Yin Limeng, Zhang Xinping. Electromigration in micro-interconnections of electronic packaging[J]. Acta Electronica Sinica, 2008, 36(8): 1610-1614.
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    [9] 何洪文, 徐广臣, 郭 福. 电迁移促进Cu/Sn-58Bi /Cu焊点阳极界面Bi层形成的机理分析[J]. 焊接学报, 2010, 31(10): 35-42. He Hongwen, Xu Guangchen, Guo Fu. Mechanism investigation of Bi layer formation at anode interface in Cu/Sn-58Bi/Cu solder joint induced byelectromigration[J]. Transactions of the China Welding Institution, 2010, 31(10): 35-42.
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  • 收稿日期:  2014-12-09

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