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绝缘铜丝微型电阻焊过程中的动态电阻分析

Research on dynamic resistance in resistance microwelding of insulated copper wire

  • 摘要: 为研究绝缘铜丝微型电阻焊过程中的动态电阻变化规律,构建了动态电阻测试系统,该测试系统由PC机、数据采集卡、数字触发电路和电流传感器等部分组成. 通过动态电阻测量、贴合面组织状态观察和能谱分析得出了动态电阻的变化规律. 结果表明,绝缘铜丝微型电阻焊的动态电阻是一条单调下降的曲线,动态电阻依次表现为膜电阻消失、收缩电阻减小和体积电阻增加,最终动态电阻达到平衡状态,呈现近似水平的变化规律. 由于贴合面无金属液相和熔核生成,收缩电阻不会消失. 发生飞溅现象时,动态电阻曲线会出现一个陡变的波峰,这一特性可作为焊接质量监控的依据和手段.

     

    Abstract: A measuring system of dynamic resistance was developed to research on the resistance microwelding (RMW) process of insulated copper wire. The testing system is mainly composed of a PC, data acquisition card, digital trigger circuit and current sensor. The change regulation is concluded by measuring the dynamic resistance combining the analysis of faying surface by scanning electron microscopy and energy dispersive spectroscopy. The results show that the dynamic resistance is a monotonously decreasing curve due to lack of metal liquid or nugget formation; dynamic resistance manifests as disappearance of film resistance, decrease of constriction resistance and increase of bulk resistance. the dynamic resistance finally reaches an equilibrium state and shows an approximate level. A wave crest will appear when surface splash occurred. This peak characteristic can be used as the basis of weld quality monitoring.

     

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