| [1] |
蒋荣华, 肖顺珍. 砷化镓材料的发展与前景[J]. 世界有色金属, 2002(8): 7-13.Jiang Ronghua, Xiao Shunzhen. Developments and prospects of GaAs material industry[J]. World Nonferrous Metals, 2002, 8:7-13.[2] 张启运, 庄鸿寿. 钎焊手册[M]. 北京: 机械工业出版社, 2008.[3] Tsao L C. Direct active soldering of micro-aro oxidized Ti/Ti joints in air using Sn3.5Ag0.5Cu4Ti(RE) filler[J]. Materials Science & Engineering A, 2013, 565: 63-71.[4] Zhang Y, Feng D, He Z Y. Progress in joining ceramics to metal[J]. Journal of Iron and Steel Research International, 2006, 13(2): 01-05.[5] 邹家生, 许志荣, 蒋志国, 等. Ti-Zr-Ni-Cu非晶钎料[J]. 焊接学报, 2005, 26(10): 51-54.Zou Jiasheng, Xu Zhirong, Jiang Zhiguo,et al. Research of Ti-Zr-Ni-Cu based amorphous brazing material[J]. Transactions of the China Welding Institution, 2005, 26(10): 51-54.[6] 曲仕尧, 邹增大,王新洪. Ag-Cu-Ti活性钎料热力学分析[J]. 焊接学报, 2003, 24(4): 13-17.Qu Shiyao, Zou Zengda, Wang Xinhong. Thermodynamic analysis of a Ag-Cu-Ti active brazing alloy[J]. Transactions of the China Welding Institution, 2003, 24(4): 13-17.[7] Peng C, Chen M X, Liu S,et al. Die bonding of silicon and other materials with active solder[C]//International Conference on Electronic Packaging Technology & High Density Packaging, IEEE, 2010(11): 275-278.[8] Chang S Y, Chuang T H, Yang C L,et al. Low temperature bonding of alumina/alumina and alumina/copper in air using Sn3.5Ag4Ti(Ce,Ga) filler[J]. Journal of Materials Engineering and Performance, 2003, 12(4): 383-389.[9] Cheng L X, Li G Y. A novel low temperature active bonding of Si/Si with Sn3.5Ag4Ti(Ce,Ga) alloy filler[J]. Materials Letter, 2016, 165: 103-106.[10] Li J G. Energetics of metal/ceramic interfaces, metal-semiconductor Schottky contacts, and their relationship[J]. Materials Chemistry and Physics, 1997, 47(2-3): 126-145.[11] Cheng L X, Li G Y, Li Z L,et al. Effect of titanium on active bonding between Sn3.5Ag4Ti (Ce, Ga) alloy filler and alumina[J]. Journal of Materials Science: Materials in Electronics, 2015, 26(8): 6004-6012.[12] 梁英教. 无机物热力学数据手册[M]. 沈阳: 东北大学出版社, 1993.[13] Liu Y, Tedenac J C. An updated thermodynamic modeling of the Ga-Ti system[J]. CALPHAD:Computer Coupling Of Phase Diagram and Thermochemistry, 2013(41): 140-149.[14] Lide D. Journal of physical and chemical reference data[M]. The American Chemical Society and the American Instutute of Physics, 1982.[15] 尹建华, 李志伟. 半导体硅材料基础[M]. 北京: 北京化工出版社, 2012.
|
下载:
