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Sn-Ag复合粉末低温过渡液相连接Cu/Ag异基金属

邵华凯1,吴爱萍1,2,3,包育典1

邵华凯1,吴爱萍1,2,3,包育典1. Sn-Ag复合粉末低温过渡液相连接Cu/Ag异基金属[J]. 焊接学报, 2017, 38(10): 80-84. DOI: 10.12073/j.hjxb.20151117004
引用本文: 邵华凯1,吴爱萍1,2,3,包育典1. Sn-Ag复合粉末低温过渡液相连接Cu/Ag异基金属[J]. 焊接学报, 2017, 38(10): 80-84. DOI: 10.12073/j.hjxb.20151117004

Sn-Ag复合粉末低温过渡液相连接Cu/Ag异基金属

  • 摘要: 基于锡-银复合粉末低温过渡液相连接,研究了银含量对接头组织及其力学性能的影响. 结果表明,接头组织由界面扩散反应区和粉末原位反应区组成. 随着银含量的增加,原位反应区Ag3Sn数量增多而晶粒尺寸减小,且扩散反应区IMC层厚度减小;当银含量(质量分数,下同)超过70%时,接头中残留大量银颗粒,并伴随孔洞的产生. 接头力学性能随银含量变化呈先升高后降低的趋势,55%时达到最优,抗剪强度超过35 MPa,显微硬度为70 HV左右. 银含量较低(≤55%)时接头主要断裂在原位反应区,较高时(≥70%)则断裂在原位反应区与扩散反应区的界面处.
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出版历程
  • 收稿日期:  2015-11-16

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