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HE Jinjiang, XU Xueli, WANG Yue, LI Yongjun. Soldering titanium & copper with Ni/Al self-propagating multilayer foil[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(1): 109-112.
Citation: HE Jinjiang, XU Xueli, WANG Yue, LI Yongjun. Soldering titanium & copper with Ni/Al self-propagating multilayer foil[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(1): 109-112.
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Soldering titanium & copper with Ni/Al self-propagating multilayer foil

  • GRIKIN Advanced Materials Company Limited, Beijing 102200, China

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  • Received Date: June 04, 2013
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  • Soldering titanium and copper using Ni/Al self-propagating multilayer foil as thermal source instead of traditional heater. Flatness, soldering ratio, shearing strength and the interface of Ni/Al self-propagating multilayer foil and solder were evaluated. There was little difference before and after soldering of the assembly temperature. The weld assembly achieved flatness within 0.1 mm, soldering ratio was 98.3% and shearing strength was 40.791 MPa. SEM analysis showed that there was a close joint between Ni/Al foil and solder. Residual stress in joint was reduced with the deintegarion of Ni/Al foil and solder flowed through the fissure.
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