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LU Wei, ZHANG Ning, SHI Yaowu, LEI Yongping. Effect of loading rate on shear strength of SnAgCu solder joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2010, (9): 57-60.
Citation: LU Wei, ZHANG Ning, SHI Yaowu, LEI Yongping. Effect of loading rate on shear strength of SnAgCu solder joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2010, (9): 57-60.
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Effect of loading rate on shear strength of SnAgCu solder joint

  • School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China

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  • Received Date: April 19, 2009
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  • Effect of loading rate on shear strength and fracture mode of SnAgCu(SAC) lead-free solder joint was investigated.The Ag content of the solders used in the experiment was 1% to 3%.The loading rate of the solder joint was 0.01 mm/s to 10 mm/s.The results indicated that the shear strength increased with the increase of loading rate and fracture with ductile feature occured inside the solder,when the loading rate was less than 1 mm/s.When loading rate reached to 10 mm/s,the shear strength decreased and brittle fracture occured in the intermetallic compounds layer of joint.Moreover,shear strength increased with Ag content of solder increased at low loading rate,while the shear strength of solder joint with 2% Ag was the lowest at high loading rate.
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