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黄永德, 彭鹏, 郭伟, 周兴汶, 程国文, 刘强. 纳米铜基柔性导电薄膜制备现状及前景[J]. 焊接学报, 2022, 43(11): 147-156. DOI: 10.12073/j.hjxb.20220709002
引用本文: 黄永德, 彭鹏, 郭伟, 周兴汶, 程国文, 刘强. 纳米铜基柔性导电薄膜制备现状及前景[J]. 焊接学报, 2022, 43(11): 147-156. DOI: 10.12073/j.hjxb.20220709002
HUANG Yongde, PENG Peng, GUO Wei, ZHOU Xingwen, CHENG Guowen, LIU Qiang. Current status and prospect of preparation of nano-copper based flexible conductive films[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(11): 147-156. DOI: 10.12073/j.hjxb.20220709002
Citation: HUANG Yongde, PENG Peng, GUO Wei, ZHOU Xingwen, CHENG Guowen, LIU Qiang. Current status and prospect of preparation of nano-copper based flexible conductive films[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(11): 147-156. DOI: 10.12073/j.hjxb.20220709002

纳米铜基柔性导电薄膜制备现状及前景

Current status and prospect of preparation of nano-copper based flexible conductive films

  • 摘要: 纳米铜基导电薄膜具有高导电、高性价比且易与柔性基材结合等优点,在下一代柔性电子产品领域具有广泛的应用前景. 然而,纳米铜基导电薄膜在制备的过程中易被氧化,成为制备高导电纳米铜基导电薄膜的难题. 文中从油墨配方、印刷方法、烧结方法等方面系统地介绍了纳米铜基柔性导电薄膜的制造方法,着重介绍了目前抗氧化油墨的设计思路,阐明了目前柔性电子先进微纳连接技术的工艺流程,对比了其优缺点及适用范围,并列举了纳米铜基导电薄膜在下一代柔性电子产品领域的典型应用. 在此基础上,对纳米铜柔性导电薄膜制造尚存的主要问题进行了总结,并对其未来发展趋势进行了展望.

     

    Abstract: Nano-copper based flexible conductive films exhibit attracting prospects for applications in next- generation flexible devices owing to the high conductivity, low-cost, and easy integration. However, the conductivity of these films suffers from the poor oxidation resistance of nanostructured copper during manufacturing, which becomes the problem of fabricating high electric conductivity nano-copper based flexible conductive films. Herein, the manufacturing routes for fabrication of these films including ink synthesis, printing, and sintering methods have been reviewed, especially highlighting the synthesis methods of the anti-oxidation inks. Features and applications of various advanced micro-nano joining processes for manufacturing flexible electronics have been discussed. Meanwhile, demonstrations of the conductive films in constructing flexible electronics are listed. Furthermore, remaining challenges and development trends for the fabrication of conductive films are concluded and prospected.

     

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