Sn元素添加量对Zn4Al3Cu钎料电阻率及钎焊工艺性能的影响

赵快乐; 杜凝; 闫焉服; 李臣阳

Sn元素添加量对Zn4Al3Cu钎料电阻率及钎焊工艺性能的影响

Impact of addition of Sn on resistivity and solderability of Zn4Al3Cu solder

摘要

摘要: 采用合金化原理在Zn4Al3Cu基体上添加0~15%Sn,研究了Zn4Al3CuxSn钎料合金的电阻率和钎焊工艺性能.结果表明,随着Sn元素添加量的增加,Zn4Al3CuxSn钎料合金电阻率逐渐降低;当Sn元素添加量为15%时,Zn4Al3Cu15Sn钎料合金的电阻率为7.9×10^-7Ω·m,较基体钎料降低47%.Sn元素添加量不大于10%时,随着Sn元素添加量的增加,Zn4Al3CuxSn钎料合金铺展面积直线上升,其中Zn4Al3Cu10Sn铺展面积最大为98.3 mm²,较基体钎料提高了59.1%,这主要与形成SnZn共晶相及界面金属间化合物有关.因此从Sn元素对钎料合金电阻率及钎焊工艺性能影响考虑,最佳Sn元素添加量为10%.

Abstract: The resistivity and solder abilities of Zn4Al3CuxSn solder alloy were investigated by adding Sn(0 - 15%) into Zn4Al3Cu alloy through alloying principle. Results show that the resistivity of the Zn4Al3CuxSn solders is reduced with the increasing of the addition of Sn.The resistivity of the Zn4Al3Cu15Sn solder is 7.9×10^{- 7} Ω·m which is approximately 47.0% lower than that of the matrix solder.When the content of Sn is lower than 10%,the spreading area of the Zn4Al3CuxSn solder alloy is increased linearly.The spreading area of Zn4Al3Cu10Sn reaches to the maximum value of 98.3 mm², which is about 59.1% larger than that of the matrix solder.It is mainly related to the formation of the new SnZn eutectic phase and the metal intermetallic compounds between the solder and the substrate.Therefore,for the consideration of resistivity and spreading property of the novel solders,the proper addition of Sn is about 10%.

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