Abstract: Because of the size effect, metal nanoparticles have become the key packaging materials suitable for the third-generation semiconductor due to their low-temperature sintering, excellent electrothermal properties, mechanical reliability and high-temperature resistance. Silver has been widely studied and successfully applied in commercial applications because of its high oxidation resistance. Based on the field of power device packaging, the research progress of the low-temperature sintering nano silver paste was summarized, including the sintering mechanism, preparation method, performance optimization, sintering methods, reliability and commercial application of silver nanoparticles. The results showed that with the better understanding of sintering theory, the size and surface modification of silver nanoparticles can be purposefully optimized, and new products based on silver nanoparticles can be derived to adapt to different sintering processes and performance requirements.