Abstract: Metallic nanomaterials are one of the key electronic packaging materials required for power devices in service under high temperature, high pressure and high frequency operating conditions due to their good electrical, thermal conductivity and the ability to be sintered at low temperatures. In this paper, the research on sintering of Cu particles used in power device packaging is reviewed. The current research and development background of low-temperature bonding through Cu particle sintering technology is expounded. The mechanical and electrical properties of low-temperature sintered Cu particle material joints based on different sintering mechanisms are discussed and summarized from the key influencing factors such as preparation of Cu particle paste, technological parameters of sintering process and reduction methods. The excellent characteristics of Cu particle sintering technology applied in the field of die attach and all-Cu interconnects are introduced. The comprehensive analyses of researches show that the current Cu particle materials are still challenged by the oxidation problem, and further in-depth research is needed to achieve precise regulation of the joint properties.